Loading...

HCF4508BM1

STMicroelectronics

HCF4508BM1 by STMicroelectronics

STMicroelectronics HCF4508BM1 is a 24-terminal bus driver with 2 functions, operating at temperatures from -40 to 85 °C. It has a propagation delay of 210ns and supports power supplies of 5-15V. Ideal for industrial applications requiring CMOS technology and true output polarity in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,060 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,060

-

-

-

-

Vyrian

USA . 2,673 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,673

-

-

-

-

Anansix

USA . 1,224 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,224

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 940 parts In-Stock

1+ parts

$0.732

100+ parts

-

1k+ parts

-

10k+ parts

-

940

$0.732

-

-

-

Northwest PG Solutions

USA . 1,158 parts In-Stock

1+ parts

$0.805

100+ parts

-

1k+ parts

-

10k+ parts

-

1,158

$0.805

-

-

-

Andel Nordic

Denmark . 273 parts In-Stock

1+ parts

$7.649

100+ parts

-

1k+ parts

$7.343

10k+ parts

$7.343

273

$7.649

-

$7.343

$7.343

IDEA Electronic Components Group

UK . 1,002 parts In-Stock

1+ parts

$23.558

100+ parts

-

1k+ parts

$21.203

10k+ parts

-

1,002

$23.558

-

$21.203

-

MKK Technologies

India . 23 parts In-Stock

1+ parts

$44.300

100+ parts

-

1k+ parts

-

10k+ parts

-

23

$44.300

-

-

-

DigiPath Technology Company

USA . 23 parts In-Stock

1+ parts

$44.300

100+ parts

-

1k+ parts

-

10k+ parts

-

23

$44.300

-

-

-

Parana Technologies

USA . 2,317 parts In-Stock

1+ parts

-

100+ parts

$28.168

1k+ parts

-

10k+ parts

-

2,317

-

$28.168

-

-

Corphita

USA . 1,615 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,615

-

-

-

-

Overview

Enhance your electronic projects with the HCF4508BM1 by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality bus drivers and transceivers that are versatile and reliable. This product offers 2 functions in a compact small outline package, making it perfect for a wide range of applications. With a true output polarity and 3-state characteristics, the HCF4508BM1 provides value, efficiency, and performance that will exceed your expectations. Upgrade your designs today with STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring longevity and ease of handling.

Surface Mount: YES

Being surface mountable allows for easy integration into circuit boards, making the product suitable for compact designs.

No. of Functions: 2

Having 2 functions in a single component increases functionality and efficiency in the circuit design.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy placement and alignment on the circuit board, enhancing overall assembly.

No. of Bits: 4

With 4 bits, the product offers a decent level of data processing capability, suitable for a variety of applications.

Power Supplies (V): 5/15

Supporting a range of power supplies from 5V to 15V, the product offers flexibility in different operating conditions.

No. of Terminals: 24

Having 24 terminals allows for multiple connections, enabling complex circuit configurations and versatility.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it suitable for compact designs with limited real estate.

Propagation Delay (tpd): 210 ns

With a low propagation delay of 210 ns, the product ensures quick signal transmission, enhancing overall performance.

Maximum Operating Temperature: 85 °C

Capable of operating at temperatures up to 85 °C, the product is suitable for industrial applications with demanding environmental conditions.

Output Characteristics: 3-STATE

The 3-STATE output feature allows the product to control the output signal effectively, providing flexibility in signal manipulation.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, the product can withstand harsh cold environments, ensuring reliable operation.

Terminal Finish: TIN LEAD

The use of tin lead terminal finish ensures strong and reliable connections, enhancing the product's overall durability.

Terminal Position: DUAL

Having dual terminal positions provides redundancy and improves the stability of connections, reducing the risk of signal loss.

No. of Ports: 2

Featuring 2 ports, the product allows for simultaneous data transfer between different devices, increasing connectivity options.

Maximum Seated Height: 2.65 mm

With a low maximum seated height of 2.65 mm, the product can be used in space-constrained applications without compromising on performance.

Width: 7.5 mm

The compact width of 7.5 mm allows for efficient space utilization on the circuit board, enabling more components to be integrated.

Output Polarity: TRUE

Having a true output polarity ensures accurate signal representation, reducing the risk of errors in data processing.

Minimum Supply Voltage (Vsup): 3 V

With a low minimum supply voltage of 3V, the product can operate efficiently in low-power applications, conserving energy.

Length: 15.4 mm

The length of 15.4 mm provides a balance between space efficiency and functionality, making the product versatile for various circuit designs.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, the product can withstand harsh environmental conditions and ensure reliable operation in demanding settings.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

The gull-wing terminal form provides mechanical stability and easy soldering, ensuring strong and reliable connections on the circuit board.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, the product allows for precise and compact connections, optimizing space utilization on the circuit board.

Maximum Supply Voltage (Vsup): 15 V

Supporting a maximum supply voltage of 15V, the product can handle higher power requirements, making it suitable for a wide range of applications.

Technical Specifications

Bus Driver & Transceivers HCF4508BM1 attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Additional Features:

WITH CLEAR

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e0

Length:

15.4 mm

Logic IC Type:

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5/15

Propagation Delay (tpd):

210 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

HCF4508BM1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-14-443-8197, 5962144438197

NIIN

144438197

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 15