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HCF4077BEY

STMicroelectronics

HCF4077BEY by STMicroelectronics

HCF4077BEY by STMicroelectronics is a CMOS logic gate with 4 functions and 2 inputs. It operates at a nominal voltage of 5V, with a propagation delay of 280ns. This component is commonly used in military-grade applications due to its wide temperature range and high reliability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,921 parts In-Stock

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Vyrian

USA . 4,221 parts In-Stock

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Anansix

USA . 979 parts In-Stock

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979

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ECAB

Sweden . 378 parts In-Stock

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Ashlea Components Ltd

UK . 10 parts In-Stock

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10

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Distributors (Availability)

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AZTECH Wire

Italy . 1,147 parts In-Stock

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$15.630

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$15.630

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IDEA Electronic Components Group

UK . 614 parts In-Stock

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$20.323

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$18.291

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614

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$18.291

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MKK Technologies

India . 1,558 parts In-Stock

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$38.216

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$38.216

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DigiPath Technology Company

USA . 1,558 parts In-Stock

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$38.216

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$38.216

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Component Stockers USA

USA . 623 parts In-Stock

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$99.990

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$99.990

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Native Components

USA . 969 parts In-Stock

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$472.500

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$463.050

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$458.325

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$453.600

969

$472.500

$463.050

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$453.600

Northwest PG Solutions

USA . 80 parts In-Stock

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$519.750

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$519.750

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QUARKTWIN TECHNOLOGY LTD

USA . 17,683 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Microchip USA

USA . 4,966 parts In-Stock

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Parana Technologies

USA . 1,518 parts In-Stock

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$24.299

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Corphita

USA . 207 parts In-Stock

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Overview

Enhance your electronic projects with the high-quality HCF4077BEY logic gates from renowned manufacturer STMicroelectronics. Designed for reliability and efficiency, these logic gates offer unparalleled performance in various applications. With a package body material of PLASTIC/EPOXY and a propagation delay of 280 ns at nominal supply voltage, this product features 4 functions and 2 inputs, making it versatile for your needs. Trust in the value and benefits that STMicroelectronics provides, and experience the advantages of using the HCF4077BEY in your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product cost-effective and lightweight, ideal for electronic applications where portability and affordability are key factors.

Propagation Delay At Nominal Supply: 280 ns

With a low propagation delay at nominal supply, this logic gate offers efficient processing speeds, making it suitable for high-speed applications where quick response times are crucial.

No. of Functions: 4

Having 4 functions in a single component increases the functionality and versatility of the product, allowing for more complex logic operations to be performed within a compact design.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard nominal supply voltage of 5V, this logic gate is compatible with a wide range of electronic systems and can be easily integrated into existing circuit designs.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C ensures reliability and stability even under harsh environmental conditions, making this logic gate suitable for industrial and military applications where temperature fluctuations are common.

Technical Specifications

Logic Gates HCF4077BEY attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e3

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

.36 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

280 ns

Propagation Delay (tpd):

280 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

5.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

HCF4077BEY Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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