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HCF4010M013TR

STMicroelectronics

HCF4010M013TR by STMicroelectronics

HCF4010M013TR by STMicroelectronics is a logic gate with 6 functions, featuring a propagation delay of 200 ns at 5V. It has a small outline package style and operates in temperatures ranging from -55°C to 125°C. Ideal for military-grade applications requiring open-drain output characteristics.

Median Price

$0.750

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$0.108

100+ parts

-

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300

$0.108

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Bristol Electronics

USA . 256 parts In-Stock

1+ parts

$0.750

100+ parts

$0.375

1k+ parts

$0.263

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-

256

$0.750

$0.375

$0.263

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American Microsemiconductor Inc.

USA . 17,500 parts In-Stock

1+ parts

$1.060

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17,500

$1.060

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Vyrian

USA . 5,087 parts In-Stock

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5,087

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Sinequanon

UK . 5,000 parts In-Stock

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5,000

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Anansix

USA . 2,762 parts In-Stock

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2,762

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Zilex Electronics Inc.

Canada . 2,279 parts In-Stock

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2,279

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Digiode

USA . 731 parts In-Stock

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731

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Dan-Mar Components

USA . 256 parts In-Stock

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256

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 417 parts In-Stock

1+ parts

$1.749

100+ parts

-

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417

$1.749

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Ampacity Inc.

Singapore . 583 parts In-Stock

1+ parts

$7.000

100+ parts

-

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583

$7.000

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IDEA Electronic Components Group

UK . 2,273 parts In-Stock

1+ parts

$12.955

100+ parts

-

1k+ parts

$11.660

10k+ parts

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2,273

$12.955

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$11.660

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AZTECH Wire

Italy . 430 parts In-Stock

1+ parts

$15.143

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430

$15.143

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MKK Technologies

India . 325 parts In-Stock

1+ parts

$24.362

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325

$24.362

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DigiPath Technology Company

USA . 325 parts In-Stock

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$24.362

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325

$24.362

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Perfect Parts

USA . 44,079 parts In-Stock

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44,079

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Authorized Procurement Solutions

USA . 22,000 parts In-Stock

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Lixinc

USA . 15,806 parts In-Stock

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Assy Fe

Spain . 7,500 parts In-Stock

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7,500

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A-Z Elektronik GmbH

Germany . 5,138 parts In-Stock

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5,138

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 4,482 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,425 parts In-Stock

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3,425

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Infinite Electronics LLP (Excess)

. 2,403 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

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$0.106

1k+ parts

$0.103

10k+ parts

$0.100

1,000

-

$0.106

$0.103

$0.100

Parana Technologies

USA . 268 parts In-Stock

1+ parts

-

100+ parts

$15.490

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268

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$15.490

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Overview

Unlock the power of seamless logic gate operation with the HCF4010M013TR by STMicroelectronics. Crafted with precision and expertise, this high-quality component offers unparalleled performance in various applications. From industrial automation to consumer electronics, this versatile product delivers value and reliability with a nominal supply voltage of 5V and a propagation delay of just 200ns. Trust in the reputation of STMicroelectronics and experience the benefits of exceptional quality, efficiency, and innovation with the HCF4010M013TR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, suitable for various applications.

Propagation Delay At Nominal Supply: 200 ns

With a fast propagation delay, this product ensures quick signal processing, making it ideal for time-sensitive applications.

Surface Mount: YES

Being surface mountable, this product can be easily integrated onto circuit boards, saving space and simplifying assembly processes.

No. of Functions: 6

With six functions in one package, this product offers versatility and efficiency, making it a cost-effective solution for multiple logic gate requirements.

Nominal Supply Voltage / Vsup (V): 5

Designed to operate at a nominal supply voltage of 5V, this product is compatible with standard power sources, making it easy to incorporate into existing systems.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF ensures stable operation and optimal performance in various circuit configurations.

Power Supplies (V): 5/15

With support for dual power supplies of 5V and 15V, this product offers flexibility in voltage requirements, catering to different circuit designs.

No. of Terminals: 16

Featuring 16 terminals, this product provides ample connection points for complex circuit designs, enhancing connectivity options.

Package Style (Meter): SMALL OUTLINE

The small outline package style of this product saves space, making it suitable for compact electronic devices and applications with limited board space.

Propagation Delay (tpd): 200 ns

With a propagation delay of 200 ns, this product ensures efficient and reliable signal transmission, meeting the timing requirements of high-speed circuits.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand harsh environmental conditions, ensuring reliability in extreme temperatures.

Output Characteristics: OPEN-DRAIN

The open-drain output characteristics of this product allow for easy interfacing with other components, simplifying circuit design and reducing complexity.

Minimum Operating Temperature: -55 °C

Designed to function at temperatures as low as -55°C, this product is suitable for use in cold environments or applications with temperature fluctuations.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of nickel/palladium/gold provides excellent conductivity and corrosion resistance, ensuring long-lasting performance in diverse operating conditions.

Terminal Position: DUAL

With dual terminal positions, this product offers flexibility in installation and connection options, accommodating different circuit layouts and requirements.

Technical Specifications

Logic Gates HCF4010M013TR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Additional Features:

HIGH TO LOW LEVEL TRANSLATOR

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

200 ns

Propagation Delay (tpd):

200 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

HCF4010M013TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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