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BTB08-400CRG

STMicroelectronics

BTB08-400CRG by STMicroelectronics

The STMicroelectronics BTB08-400CRG is a TRIAC with 8A RMS on-state current, 400V repetitive peak off-state voltage, and 25mA max DC gate trigger current. It is used in AC power control applications due to its high holding current and low leakage current capabilities.

Median Price

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Lifecycle Status

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7

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Vyrian

USA . 5,467 parts In-Stock

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Anansix

USA . 1,929 parts In-Stock

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Digiode

USA . 1,569 parts In-Stock

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Lakeland Logistics Inc

USA . 126 parts In-Stock

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Bristol Electronics

USA . 126 parts In-Stock

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Microfarads

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R&J Components

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IDEA Electronic Components Group

UK . 620 parts In-Stock

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$3.565

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$3.208

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MKK Technologies

India . 1,787 parts In-Stock

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$6.704

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DigiPath Technology Company

USA . 1,787 parts In-Stock

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AZTECH Wire

Italy . 219 parts In-Stock

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$18.960

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Component Stockers USA

USA . 432 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 27,143 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,894 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,596 parts In-Stock

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Corphita

USA . 4,381 parts In-Stock

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Perfect Parts

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RC Electronics

USA . 2,355 parts In-Stock

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Authorized Procurement Solutions

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Metaverse IC Inc.

Canada . 1,387 parts In-Stock

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Northwest PG Solutions

USA . 955 parts In-Stock

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Native Components

USA . 101 parts In-Stock

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$4.249

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Parana Technologies

USA . 24 parts In-Stock

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$4.262

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Overview

Unlock the power of seamless AC control with the STMicroelectronics BTB08-400CRG TRIAC. Known for its superior quality and reliability, STMicroelectronics is a trusted name in the industry. Ideal for a variety of applications, this TRIAC offers customers unmatched value with its high performance and efficiency. Say goodbye to complicated AC control systems and experience the benefits of simplified operation with the BTB08-400CRG.

Feature Benefit Bullets

Maximum DC Gate Trigger Current: 25 mA

A low maximum DC gate trigger current means that less power is required to switch the TRIAC on, leading to better efficiency and lower power consumption.

Maximum Leakage Current: 0.5 mA

The low maximum leakage current ensures that the TRIAC maintains a high level of stability and reliability, reducing the chances of accidental conduction.

Trigger Device Type: TRIAC

Being a TRIAC, this product is suitable for handling both AC currents, making it versatile and suitable for a wide range of applications.

Maximum RMS On-state Current: 8 A

With a maximum RMS on-state current of 8A, this TRIAC can handle medium to high power loads, making it a great choice for applications requiring higher currents.

Repetitive Peak Off-state Voltage: 400 V

The high repetitive peak off-state voltage of 400V makes this TRIAC suitable for handling high voltage applications, ensuring safety and reliability.

Minimum Critical Rate of Rise of Commutation Voltage: 5 V/us

The minimum critical rate of rise of commutation voltage of 5V/us ensures fast and efficient switching of the TRIAC, reducing the chances of voltage spikes and ensuring smooth operation.

Minimum Critical Rate of Rise of Off-state Voltage: 50 V/us

The minimum critical rate of rise of off-state voltage of 50V/us helps in maintaining the stability and reliability of the TRIAC, preventing unintentional triggering and ensuring safe operation.

Maximum Holding Current: 50 mA

The maximum holding current of 50mA ensures that the TRIAC remains in an on-state even after the gating current is removed, providing reliable operation and stability.

Technical Specifications

Triode For Alternating Current (TRIAC) BTB08-400CRG attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Minimum Critical Rate of Rise of Commutation Voltage:

5 V/us

Minimum Critical Rate of Rise of Off-state Voltage:

50 V/us

Maximum DC Gate Trigger Current:

25 mA

Maximum Holding Current:

50 mA

Maximum Leakage Current:

.5 mA

Maximum RMS On-state Current:

8 A

Repetitive Peak Off-state Voltage:

400 V

Sub-Category:

TRIACs

Surface Mount:

NO

Trigger Device Type:

Trade Compliance

BTB08-400CRG Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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