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BFR99

STMicroelectronics

BFR99 by STMicroelectronics

BFR99 by STMicroelectronics is a PNP RF small signal BJT designed for amplifier applications. It features a max power dissipation of 0.225 W, operates up to 2000 MHz, and withstands temperatures up to 175 °C. Its cylindrical metal package ensures durability in ultra-high frequency settings.

Median Price

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Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

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Digiode

USA . 4,012 parts In-Stock

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4,012

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Anansix

USA . 1,454 parts In-Stock

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1,454

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LIBRA Elektronik GmbH

Germany . 779 parts In-Stock

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Vyrian

USA . 176 parts In-Stock

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ECAB

Sweden . 162 parts In-Stock

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Manotoh

Italy . 150 parts In-Stock

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150

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ComSIT Distribution GmbH

Germany . 136 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 87 parts In-Stock

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87

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GES GmbH

Germany . 58 parts In-Stock

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Resion

USA . 24 parts In-Stock

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LittleDiode

UK . 18 parts In-Stock

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R&J Components

USA . 16 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 10 parts In-Stock

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Electronic Expediters

USA . 3 parts In-Stock

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Native Components

USA . 42 parts In-Stock

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$0.321

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$0.308

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Northwest PG Solutions

USA . 1,966 parts In-Stock

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$0.353

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$0.311

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$0.311

IDEA Electronic Components Group

UK . 1,992 parts In-Stock

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$1.121

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$1.009

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MKK Technologies

India . 1,582 parts In-Stock

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$2.107

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DigiPath Technology Company

USA . 1,582 parts In-Stock

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Corphita

USA . 3,446 parts In-Stock

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Parana Technologies

USA . 1,776 parts In-Stock

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$1.340

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Assy Fe

Spain . 11 parts In-Stock

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Overview

Unlock superior performance with the BFR99 from STMicroelectronics—your go-to choice for reliable RF amplification! Crafted with precision and designed for ultra-high frequency applications, this PNP bipolar junction transistor guarantees exceptional quality and durability. With its robust metallic construction and high-temperature capability, the BFR99 empowers innovative projects in communications and beyond, delivering unmatched value and performance to elevate your designs.

Feature Benefit Bullets

Package Body Material: METAL

The use of metal for the package body enhances durability, provides better heat dissipation, and ensures protection against external interference.

Polarity or Channel Type: PNP

As a PNP transistor, this product is suitable for applications requiring reverse bias operation, making it versatile for various amplifier configurations.

Configuration: SINGLE

The single configuration is ideal for space-constrained designs, allowing for simpler circuit integration and minimized footprint.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, this transistor can deliver high-performance signal amplification, crucial for RF circuits.

Package Shape: ROUND

The round shape of the package aids in maintaining a compact design while providing uniform thermal performance.

Terminal Form: WIRE

Wire terminal form allows for flexible connectivity options, accommodating various PCB layouts and assembly requirements.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

With its capability to operate in the ultra-high frequency band, this transistor is suitable for advanced communications and RF applications.

No. of Terminals: 4

The four-terminal design provides ample connectivity for gain control and feedback mechanisms, enhancing circuit performance.

Maximum Power Dissipation (Abs): 0.225 W

A maximum power dissipation of 0.225 W indicates that this transistor can handle decent power levels, promoting reliable operation in demanding applications.

Package Style (Meter): CYLINDRICAL

A cylindrical package style ensures excellent thermal characteristics and mechanical strength, ideal for high-frequency applications.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175 °C, this transistor can function effectively in high-temperature environments, increasing its versatility in real-world applications.

Maximum Collector-Emitter Voltage: 25 V

A collector-emitter voltage rating of 25 V makes this transistor suitable for a variety of low to medium voltage applications, ensuring compatibility with many designs.

Transistor Element Material: SILICON

Silicon as the element material means good performance characteristics, including low leakage current, which is essential for high-frequency operations.

Maximum Collector Current (IC): 0.05 A

With a maximum collector current of 0.05 A, this product can deliver moderate current levels suitable for many small signal applications.

Terminal Finish: TIN LEAD

The tin-lead terminal finish ensures reliable solderability and robustness during assembly, which is crucial for maintaining signal integrity.

Terminal Position: BOTTOM

Bottom terminal positioning allows for easier PCB layout and improved space efficiency, facilitating compact design strategies.

Nominal Transition Frequency (fT): 2000 MHz

A transition frequency of 2000 MHz signifies high-speed switching capabilities, making this transistor an excellent choice for RF applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BFR99 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from STMicroelectronics

Specs

Additional Features:

LOW NOISE

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

25 V

Configuration:

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-72

JESD-30 Code:

O-MBCY-W4

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

175 Cel

Package Body Material:

METAL

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

PNP

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

WIRE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BFR99 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-15-135-0335, 5961151350335

NIIN

151350335

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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