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ACST12-7SG-TR

STMicroelectronics

ACST12-7SG-TR by STMicroelectronics

ACST12-7SG-TR by STMicroelectronics is a single TRIAC designed for efficient AC control, featuring a max RMS on-state current of 12 A and a repetitive peak off-state voltage of 700 V. It operates in temperatures from -40 °C to 125 °C. Ideal for applications requiring compact surface mount solutions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,735 parts In-Stock

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3,735

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Anansix

USA . 2,788 parts In-Stock

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2,788

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Vyrian

USA . 2,609 parts In-Stock

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2,609

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 95 parts In-Stock

1+ parts

$2.564

100+ parts

-

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$2.308

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95

$2.564

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$2.308

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MKK Technologies

India . 1,290 parts In-Stock

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$4.822

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1,290

$4.822

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DigiPath Technology Company

USA . 1,290 parts In-Stock

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$4.822

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1,290

$4.822

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AZTECH Wire

Italy . 748 parts In-Stock

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$18.500

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748

$18.500

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QUARKTWIN TECHNOLOGY LTD

USA . 23,368 parts In-Stock

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23,368

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A-Z Elektronik GmbH

Germany . 6,792 parts In-Stock

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6,792

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Alle Elektronik GmbH

Germany . 4,528 parts In-Stock

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4,528

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Corphita

USA . 3,760 parts In-Stock

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3,760

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Parana Technologies

USA . 1,557 parts In-Stock

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$3.066

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1,557

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$3.066

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Northwest PG Solutions

USA . 1,161 parts In-Stock

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Perfect Parts

USA . 847 parts In-Stock

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847

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Native Components

USA . 219 parts In-Stock

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219

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Overview

Unlock the potential of your projects with the ACST12-7SG-TR from STMicroelectronics. Renowned for quality and innovation, STMicroelectronics delivers a TRIAC that excels in performance and reliability, perfect for diverse applications like motor control and lighting systems. With its compact design and robust capabilities, this device ensures seamless operation under varying temperatures. Experience enhanced efficiency and superior longevity that elevate your designs to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body contributes to lightweight construction and enhanced durability.

Maximum DC Gate Trigger Current: 10 mA

A low maximum gate trigger current makes this TRIAC energy-efficient, allowing it to operate with minimal power consumption.

Configuration: SINGLE

Single configuration simplifies circuit design and allows for easier integration into various applications.

Surface Mount: YES

The surface mount capability ensures compatibility with modern PCB designs, allowing for more compact and efficient layouts.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB for improved component placement and thermal management.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical strength and make soldering easier during assembly.

Maximum Leakage Current: 1.5 mA

A low maximum leakage current minimizes power loss and enhances overall system efficiency, making it suitable for sensitive applications.

No. of Terminals: 2

Having just two terminals simplifies connections and reduces potential points of failure in the circuit.

Package Style (Meter): SMALL OUTLINE

The small-outline package style is ideal for space-constrained applications, allowing for high-density designs.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures ensures reliability and performance in demanding environments.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

This TRIAC can be triggered in all four quadrants, providing flexibility for various control schemes and enhancing its versatility.

Minimum Operating Temperature: -40 °C

A wide operating temperature range makes this product robust and suitable for use in extreme conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring long-term reliability.

Terminal Position: SINGLE

Single terminal position makes routing on PCB straightforward and minimizes design complexity.

Maximum RMS On-state Current: 12 A

A high maximum on-state current capability allows the TRIAC to handle substantial loads in various applications.

Maximum DC Gate Trigger Voltage: 1 V

The low maximum gate trigger voltage enhances safety and reduces the risk of unintentional triggering.

Repetitive Peak Off-state Voltage: 700 V

High repetitive peak off-state voltage ensures that this TRIAC can manage significant voltage stresses commonly found in industrial applications.

Minimum Critical Rate of Rise of Off-state Voltage: 200 V/μs

A high critical rate of rise implies better performance in protecting against voltage spikes, increasing overall circuit stability.

Maximum Holding Current: 30 mA

This relatively low holding current allows for improved control in circuits where the TRIAC needs to be turned off quickly.

Maximum Time At Peak Reflow Temperature (s): 30

A reasonable maximum time at peak reflow temperature supports various soldering processes while ensuring component reliability.

Peak Reflow Temperature: 245 °C

High reflow temperature compatibility allows this TRIAC to withstand modern assembly methods without damage.

Technical Specifications

Triode For Alternating Current (TRIAC) ACST12-7SG-TR attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

200 V/us

Maximum DC Gate Trigger Current:

10 mA

Maximum DC Gate Trigger Voltage:

1 V

Maximum Holding Current:

30 mA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Maximum Leakage Current:

1.5 mA

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

245

Qualification:

Not Qualified

Maximum RMS On-state Current:

12 A

Repetitive Peak Off-state Voltage:

700 V

Sub-Category:

TRIACs

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Device Type:

Trade Compliance

ACST12-7SG-TR Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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