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A2C50S65M2

STMicroelectronics

A2C50S65M2 by STMicroelectronics

A2C50S65M2 by STMicroelectronics is an N-channel IGBT designed for power control applications. It features a max VCEsat of 2.3V, supports up to 50A collector current, and operates in temperatures from -40 °C to 150 °C. Ideal for high-efficiency power management systems.

Median Price

$50.820

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Avnet

USA . 108 parts In-Stock

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Future Electronics

Canada . 7 parts In-Stock

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$50.820

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Vyrian

USA . 5,069 parts In-Stock

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5,069

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Digiode

USA . 2,175 parts In-Stock

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Anansix

USA . 913 parts In-Stock

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IBS Electronics

USA . 7 parts In-Stock

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$76.126

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,684 parts In-Stock

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$1.586

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$1.427

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1,684

$1.586

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$1.427

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MKK Technologies

India . 1,092 parts In-Stock

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$2.983

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$2.983

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DigiPath Technology Company

USA . 1,092 parts In-Stock

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$2.983

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$2.983

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Native Components

USA . 746 parts In-Stock

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$7.566

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AZTECH Wire

Italy . 644 parts In-Stock

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$11.930

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Microchip USA

USA . 2,003 parts In-Stock

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$160.632

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Corphita

USA . 3,442 parts In-Stock

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Parana Technologies

USA . 2,218 parts In-Stock

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$1.896

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$1.896

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Northwest PG Solutions

USA . 675 parts In-Stock

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$7.415

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675

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$7.415

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Overview

Unlock unparalleled performance with the A2C50S65M2 from STMicroelectronics. Renowned for their innovation and quality, STMicroelectronics delivers this robust N-channel IGBT, designed for power control applications where efficiency is paramount. With exceptional thermal management and a compact design, it ensures reliability under demanding conditions. Elevate your projects with a trusted solution that maximizes performance while minimizing costs—experience the difference with ST!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically offer lower on-resistance and better performance in high-voltage applications, making this product a strong choice for power control.

Configuration: COMPLEX

Complex configurations allow for enhanced functionality in various power applications, providing versatility in design.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance in managing electrical power efficiently.

Maximum VCEsat: 2.3 V

A low VCEsat indicates reduced power loss and improved efficiency, making this IGBT effective for high-power applications.

Package Shape: RECTANGULAR

The rectangular package shape aids in maximizing space efficiency in various electronic designs.

No. of Elements: 7

With seven elements, this product enhances its capability to handle complex circuits and improve reliability.

Nominal Turn Off Time (toff): 298 ns

A fast turn-off time allows for higher switching frequencies, leading to better performance in dynamic applications.

No. of Terminals: 35

An ample number of terminals offers flexibility in circuit design and provides multiple connection options for various applications.

Maximum Power Dissipation (Abs): 208 W

High power dissipation capability ensures reliable operation under heavy loads, suitable for demanding applications.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging enables secure installation and effective heat dissipation, critical for high-performance environments.

Maximum Operating Temperature: 150 °C

High temperature tolerance allows the IGBT to function in more extreme environments, enhancing its reliability and longevity.

Maximum Collector-Emitter Voltage: 650 V

A 650 V rating ensures this IGBT can handle significant voltage levels, making it suitable for various high-voltage applications.

Transistor Element Material: SILICON

Silicon is a well-established semiconductor material, ensuring reliability and compatibility in a wide range of applications.

Maximum Gate-Emitter Voltage: 20 V

A relatively high gate-emitter voltage rating permits better control and flexibility in driving the transistor.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures expands the usability of this IGBT in harsher climate conditions.

Maximum Collector Current (IC): 50 A

A high collector current rating allows this device to manage larger loads effectively, enhancing its applicability in industrial settings.

Maximum Gate-Emitter Threshold Voltage: 7 V

A moderate gate-emitter threshold voltage ensures ease of operation and compatibility with standard gate drive circuits.

Terminal Position: UPPER

Upper terminal positioning provides easier access for connections and can simplify layout designs.

Case Connection: ISOLATED

Isolated case connections enhance safety and reduce the risk of electrical interference with nearby components.

Nominal Turn On Time (ton): 167 ns

Fast turn-on times enable efficient switching operations, increasing overall system performance in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) A2C50S65M2 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X35

No. of Elements:

7

No. of Terminals:

35

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

298 ns

Nominal Turn On Time (ton):

167 ns

Maximum VCEsat:

2.3 V

Trade Compliance

A2C50S65M2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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