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74VHC157TTR

STMicroelectronics

74VHC157TTR by STMicroelectronics

74VHC157TTR by STMicroelectronics is a CMOS multiplexer with a propagation delay of just 9.5 ns and operates at supply voltages b/w 2-5.5 V. It features 4 functions, dual inputs, and is ideal for high-speed data routing in compact applications. Its military-grade design ensures reliability in extreme temperatures from -55 °C to 125°C.

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 3,941 parts In-Stock

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Digiode

USA . 3,187 parts In-Stock

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Anansix

USA . 2,883 parts In-Stock

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IDEA Electronic Components Group

UK . 1,103 parts In-Stock

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$20.112

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$18.101

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$20.112

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AZTECH Wire

Italy . 627 parts In-Stock

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$20.270

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Native Components

USA . 514 parts In-Stock

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$26.090

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$26.090

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Northwest PG Solutions

USA . 354 parts In-Stock

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$28.699

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$25.829

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$28.699

$25.829

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MKK Technologies

India . 241 parts In-Stock

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$37.820

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DigiPath Technology Company

USA . 241 parts In-Stock

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$37.820

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Microchip USA

USA . 5,784 parts In-Stock

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Corphita

USA . 4,641 parts In-Stock

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Perfect Parts

USA . 2,250 parts In-Stock

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Parana Technologies

USA . 1,102 parts In-Stock

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$24.047

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Overview

Unlock the power of innovation with the 74VHC157TTR from STMicroelectronics, a high-performance multiplexer and demultiplexer. Designed for efficiency and reliability, this component excels in applications ranging from telecommunications to consumer electronics. With its advanced CMOS technology and robust design, it offers low propagation delays and exceptional thermal stability. Trust in STMicroelectronics' legacy of quality to elevate your projects with unmatched performance and versatility!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy packaging provides reliable protection, making the product suitable for various applications and environments.

Propagation Delay At Nominal Supply: 9.5 ns

With a low propagation delay, this multiplexer/demultiplexer ensures rapid data transmission, enhancing overall system performance.

Surface Mount: YES

Surface mount compatibility allows for efficient assembly and smaller footprint in circuit designs, providing versatility in various applications.

No. of Functions: 4

Offering multiple functions in a single package helps to save space and reduce component count on a PCB, increasing design efficiency.

No. of Inputs: 2

With 2 inputs, this device is suitable for a variety of simple switching applications, catering to a range of design needs.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on PCBs, allowing for compact and efficient circuit layouts.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V makes this device compatible with many modern digital circuits and systems.

Load Capacitance (CL): 50 pF

The 50 pF load capacitance is suitable for most applications, ensuring reliable performance even under varying load conditions.

Power Supplies (V): 2/5.5

This wide range of supply voltage offers flexibility in design, allowing the device to be used in diverse electronic systems.

No. of Terminals: 16

Having 16 terminals allows for greater connectivity and versatility in circuit design, supporting various interface configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile are ideal for space-constrained applications, making it easier to integrate into compact designs.

Maximum I (ol): 8 Amp

A high output current capability of 8 Amps ensures this device can drive substantial loads, making it suitable for power applications.

Propagation Delay (tpd): 15 ns

The propagation delay of 15 ns maintains high-speed performance and responsiveness critical for dynamic data applications.

Maximum Operating Temperature: 125 °C

Withstanding high temperatures, this device is reliable in demanding environments like automotive or industrial applications.

Minimum Operating Temperature: -55 °C

This range allows the product to operate effectively in extreme cold conditions, making it suitable for aerospace and military applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish ensures excellent conductivity and resistance to corrosion, enhancing reliability over time.

Terminal Position: DUAL

Dual terminal positioning provides flexibility for routing and connection options, simplifying the design process.

Maximum Seated Height: 1.2 mm

The low seated height minimizes profile, enabling more compact designs and enhancing integration in tightly spaced electronics.

Width: 4.4 mm

A narrow width of 4.4 mm facilitates efficient use of space on PCBs, ideal for high-density applications.

Output Polarity: TRUE

True output polarity ensures compatibility with standard logic levels in digital circuits, simplifying design integration.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage of 2V ensures versatility in lower-voltage circuits, broadening application possibilities.

Length: 5 mm

The compact length of 5 mm supports dense PCB designs, making this component ideal for miniaturized electronic devices.

Temperature Grade: MILITARY

This military grade specification indicates superior reliability and performance in harsh and demanding environments.

Technology: CMOS

CMOS technology allows for low power consumption, making the device energy-efficient and ideal for battery-powered applications.

Terminal Form: GULL WING

Gull wing terminals enable easy soldering and reliable mechanical stability, enhancing connectivity in various applications.

Packing Method: TR

The Tape and Reel packing method ensures efficient handling and ease of use during automated assembly processes.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for high-density layouts while maintaining soldering ease and reliability.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V supports the needs of 5V systems, making it adaptable for a wide range of applications.

Technical Specifications

Multiplexer & Demultiplexer 74VHC157TTR attributes and parameters. Explore more Multiplexer & Demultiplexer devices from STMicroelectronics

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

9.5 ns

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74VHC157TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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