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74V1G80CTR

STMicroelectronics

74V1G80CTR by STMicroelectronics

74V1G80CTR by STMicroelectronics is a CMOS latch with a 3.3V nominal voltage, ideal for high-speed applications due to its 15 ns propagation delay and 150 MHz min frequency. It features a compact design with a max operating temp of 125 °C. This device is perfect for military-grade electronics requiring reliability in extreme conditions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,015 parts In-Stock

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5,015

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Digiode

USA . 2,864 parts In-Stock

1+ parts

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2,864

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Anansix

USA . 2,164 parts In-Stock

1+ parts

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2,164

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R&J Components

USA . 599 parts In-Stock

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599

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 253 parts In-Stock

1+ parts

$4.304

100+ parts

-

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253

$4.304

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IDEA Electronic Components Group

UK . 1,311 parts In-Stock

1+ parts

$11.500

100+ parts

-

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$10.350

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1,311

$11.500

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$10.350

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Corohmni

South Africa . 147 parts In-Stock

1+ parts

$13.222

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147

$13.222

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AZTECH Wire

Italy . 1,176 parts In-Stock

1+ parts

$21.320

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1,176

$21.320

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MKK Technologies

India . 2,105 parts In-Stock

1+ parts

$21.625

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2,105

$21.625

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DigiPath Technology Company

USA . 2,105 parts In-Stock

1+ parts

$21.625

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2,105

$21.625

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Native Components

USA . 287 parts In-Stock

1+ parts

$391.138

100+ parts

$383.315

1k+ parts

$379.404

10k+ parts

$375.493

287

$391.138

$383.315

$379.404

$375.493

Northwest PG Solutions

USA . 1,569 parts In-Stock

1+ parts

$430.252

100+ parts

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1,569

$430.252

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A-Z Elektronik GmbH

Germany . 6,215 parts In-Stock

1+ parts

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6,215

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Corphita

USA . 1,418 parts In-Stock

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1,418

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Parana Technologies

USA . 609 parts In-Stock

1+ parts

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$13.750

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609

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$13.750

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Overview

Unlock exceptional performance with the 74V1G80CTR from STMicroelectronics, a reliable solution in the world of latches and flip-flops. Designed for versatility, this compact device excels in high-speed applications while offering superior durability across extreme temperatures. Trust STMicroelectronics for quality innovation that enhances your designs, providing both efficiency and longevity. Elevate your projects with a component that combines reliability, precision, and value like no other!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and reliability, making it suitable for various electronic applications.

Surface Mount: YES

Surface mount capability allows for compact PCB designs, facilitating high-density integration and improved performance.

Package Shape: RECTANGULAR

The rectangular shape is advantageous for efficient space utilization on PCBs, accommodating tight layouts.

Nominal Supply Voltage / Vsup: 3.3 V

A nominal supply voltage of 3.3 V is widely used in modern electronics, ensuring compatibility with a range of devices.

Power Supplies (V): 2/5.5

The power supply range of 2 to 5.5 V provides flexibility for various applications, allowing the device to operate in diverse environments.

No. of Terminals: 5

With 5 terminals, this latch/flip-flop offers sufficient connectivity while maintaining a compact form factor.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile enhance space efficiency on PCBs, which is critical in space-constrained applications.

Maximum I (ol): 4 Amp

A maximum output current of 4 A allows this device to drive loads effectively, making it suitable for various high-current applications.

Propagation Delay (tpd): 15 ns

A propagation delay of 15 ns ensures fast operation, making it ideal for high-speed circuits and minimizing timing issues.

Maximum Operating Temperature: 125 °C

Operating at a high temperature limit makes this device reliable in challenging thermal environments.

Trigger Type: POSITIVE EDGE

The positive edge trigger type is standard for digital logic, simplifying integration with other components.

Minimum Operating Temperature: -55 °C

A low minimum operating temperature allows this device to function reliably in extreme cold conditions.

Terminal Finish: Matte Tin (Sn)

The matte tin finish improves solderability and enhances the durability of the electrical connections.

Terminal Position: DUAL

Dual terminal positioning provides better alignment and mechanical stability during assembly.

Maximum Seated Height: 1.1 mm

A low seated height facilitates a compact design, making the device ideal for slim applications.

Width: 1.25 mm

A narrow width contributes to the overall compactness of the design, supporting high-density layouts.

Output Polarity: INVERTED

Inverted output polarity can be utilized in various control applications, providing design flexibility.

Minimum Supply Voltage (Vsup): 2 V

Operating down to 2 V ensures compatibility with low-power devices, enhancing its versatility.

Maximum Time At Peak Reflow Temperature (s): 30

A tolerance of 30 seconds at peak reflow temperature ensures that the device is robust against soldering processes.

Peak Reflow Temperature (°C): 260

A high peak reflow temperature allows compatibility with modern soldering techniques, making it easy to assemble.

Length: 2 mm

A short length assists in space-saving designs, enabling integration into compact applications.

Temperature Grade: MILITARY

Being rated for military-grade temperature ensures reliability under extreme conditions and is suitable for critical applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminal form enhances the soldering process and provides stability on PCBs.

Packing Method: TR

Tape and reel packing method simplifies automated assembly processes, improving efficiency in manufacturing.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch allows for a compact arrangement while maintaining sufficient space for soldering.

Minimum fmax: 150 MHz

A minimum frequency of 150 MHz indicates high-speed capabilities, making it suitable for advanced digital circuits.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5 V allows for flexible usage in various electronic applications, accommodating different input requirements.

Technical Specifications

Latches & Flip-Flops 74V1G80CTR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

1.25 mm

Minimum fmax:

150 MHz

Trade Compliance

74V1G80CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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