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74V1T77CTR

STMicroelectronics

74V1T77CTR by STMicroelectronics

74V1T77CTR by STMicroelectronics is a CMOS latch with a 5V nominal voltage and operates in extreme temperatures from -55 °C to 125°C. It features a fast propagation delay of just 9 ns and can handle up to 8A output current. Ideal for military applications, it comes in a compact SOIC package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,633 parts In-Stock

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Anansix

USA . 997 parts In-Stock

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997

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Vyrian

USA . 74 parts In-Stock

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74

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,342 parts In-Stock

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$29.485

100+ parts

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$26.537

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1,342

$29.485

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MKK Technologies

India . 1,730 parts In-Stock

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$55.445

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$55.445

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DigiPath Technology Company

USA . 1,730 parts In-Stock

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$55.445

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1,730

$55.445

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Corphita

USA . 1,969 parts In-Stock

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1,969

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Parana Technologies

USA . 714 parts In-Stock

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$35.254

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Northwest PG Solutions

USA . 575 parts In-Stock

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Native Components

USA . 81 parts In-Stock

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Overview

Unlock unparalleled performance with the 74V1T77CTR from STMicroelectronics, a leader in innovation and reliability. This compact latch delivers rapid response times and exceptional durability for demanding applications, making it ideal for automotive and industrial control systems. Experience enhanced efficiency and design flexibility while benefiting from ST’s commitment to quality and cutting-edge technology. Elevate your projects with the confidence that comes from using a proven solution!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures a lightweight and durable package, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient space utilization on PCBs, enabling advanced miniaturization.

Package Shape: RECTANGULAR

A rectangular shape optimizes space on circuit boards, facilitating better component arrangement and ease of layout.

Nominal Supply Voltage / Vsup: 5 V

Operates at a common voltage level which is compatible with various existing systems, simplifying integration.

Power Supplies: 5 V

Standard power supply requirement ensures ease of availability and compatibility with a wide range of electronic devices.

No. of Terminals: 5

Five terminals provide necessary connections without excessive complexity, facilitating easier design and assembly.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile make it ideal for space-constrained applications, enhancing product versatility.

Maximum I (ol): 8 Amp

High output current capacity of 8 Amps allows the device to handle significant loads, increasing its applicability in demanding circuits.

Propagation Delay (tpd): 9 ns

A low propagation delay ensures fast switching speeds, which are critical for high-speed digital applications.

Maximum Operating Temperature: 125 °C

High temperature tolerance guarantees reliable operation in harsh environments, enhancing product durability.

Trigger Type: HIGH LEVEL

High-level triggering provides flexibility in various applications, allowing easier interfacing with standard logic levels.

Minimum Operating Temperature: -55 °C

Wide temperature range suitability ensures performance in extreme environments, making it ideal for military and aerospace applications.

Terminal Finish: Matte Tin (Sn)

The matte tin finish contributes to reliable solderability and resistance to oxidative degradation, ensuring long-term performance.

Terminal Position: DUAL

Dual terminal positioning allows for better integration possibilities and more efficient use of PCB space.

Maximum Seated Height: 1.1 mm

Low seated height enhances compatibility with low-profile designs and helps save space in compact devices.

Width: 1.25 mm

A narrow width contributes to a compact footprint, which is advantageous for space-constrained designs.

Output Polarity: TRUE

True output polarity simplifies interfacing with other components, ensuring straightforward integration in circuits.

Minimum Supply Voltage (Vsup): 4.5 V

A minimum supply voltage of 4.5 V allows for flexible power supply configurations while ensuring reliable operation.

Maximum Time At Peak Reflow Temperature (s): 30

Extended reflow time offers greater flexibility during assembly processes, facilitating reliable soldering operations.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures compatibility with various soldering techniques, improving manufacturing yield.

Length: 2 mm

Compact length facilitates versatile placements in tight electronic designs, enhancing product usability.

Temperature Grade: MILITARY

Military-grade specifications guarantee reliability and performance under extreme conditions, suitable for defense applications.

Technology: CMOS

CMOS technology offers low power consumption and high efficiency, making it well-suited for portable and battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent solder joint reliability, ensuring robust connections on PCBs.

Terminal Pitch: 0.65 mm

A fine terminal pitch allows for denser packing of components on PCBs, maximizing circuit board real estate.

Maximum Supply Voltage (Vsup): 5.5 V

A slightly elevated maximum supply voltage enhances flexibility in voltage selection for compatible circuitry.

Technical Specifications

Latches & Flip-Flops 74V1T77CTR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

HIGH LEVEL

Width:

1.25 mm

Trade Compliance

74V1T77CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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