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74V1T80STR

STMicroelectronics

74V1T80STR by STMicroelectronics

74V1T80STR by STMicroelectronics is a CMOS latch with a 5V nominal supply and operates at temperatures from -55 °C to 125°C. It features a fast propagation delay of 15 ns and supports up to 8A output current. Ideal for military applications, it comes in a low-profile SMD package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,894 parts In-Stock

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Anansix

USA . 1,282 parts In-Stock

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Digiode

USA . 1,030 parts In-Stock

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Microchip USA

USA . 123 parts In-Stock

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$0.140

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123

$0.140

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AZTECH Wire

Italy . 976 parts In-Stock

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$11.100

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976

$11.100

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IDEA Electronic Components Group

UK . 1,948 parts In-Stock

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$21.267

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$19.140

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$21.267

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$19.140

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MKK Technologies

India . 1,551 parts In-Stock

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$39.991

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$39.991

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DigiPath Technology Company

USA . 1,551 parts In-Stock

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$39.991

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Component Stockers USA

USA . 571 parts In-Stock

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$99.990

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Corphita

USA . 3,770 parts In-Stock

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Parana Technologies

USA . 2,308 parts In-Stock

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$25.428

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Northwest PG Solutions

USA . 1,816 parts In-Stock

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Native Components

USA . 321 parts In-Stock

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Overview

Unlock unparalleled performance with the 74V1T80STR from STMicroelectronics! This high-quality latch offers reliability and exceptional speed for your electronic projects, catering to military-grade applications. With a compact design and low power consumption, it seamlessly integrates into space-constrained environments. Choose STMicroelectronics for innovative solutions that drive efficiency, making the 74V1T80STR the smart choice for professionals seeking excellence in reliability and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures long-lasting performance and reliability, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern circuit boards.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space usage on the PCB, facilitating efficient layout designs.

Nominal Supply Voltage / Vsup: 5 V

Operating at a nominal 5V makes it compatible with standard logic levels, simplifying design requirements.

Load Capacitance (CL): 50 pF

With a load capacitance of 50 pF, it can drive various loads effectively without compromising performance.

Power Supplies: 5 V

Designed to operate on 5V power supply, ensuring compatibility with a wide range of existing circuits.

No. of Terminals: 5

The 5-terminal design allows for versatile connections, enhancing flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The low-profile and shrink pitch design contributes to space-saving on PCBs, ideal for compact devices.

Maximum I (ol): 8 Amp

Capable of supplying up to 8 Amps, this product can handle higher current demands, making it suitable for power applications.

Propagation Delay (tpd): 15 ns

A low propagation delay of 15 ns ensures high-speed performance, essential for fast signal processing applications.

Maximum Operating Temperature: 125 °C

Rated for high operating temperatures, this latch/flip-flop can be effectively used in demanding environments.

Trigger Type: POSITIVE EDGE

The positive edge trigger enhances synchronization and stability in digital circuits.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55 °C, it is perfect for applications in extreme conditions.

Terminal Finish: TIN

Tin terminal finish ensures reliable solderability and improves overall product durability.

Terminal Position: DUAL

The dual terminal position helps in flexible PCB layouts and better component placement.

Maximum Seated Height: 1.45 mm

The low seated height maximizes tray density during packaging and minimizes the overall footprint on the PCB.

Width: 1.625 mm

A narrow width of 1.625 mm contributes to compact layouts, ideal for space-constrained applications.

Output Polarity: INVERTED

The inverted output polarity may be advantageous in specific circuit configurations requiring such signal inversion.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5 V offers flexibility in power supply design and adaptability to various systems.

Length: 2.9 mm

A compact length of 2.9 mm allows for denser component integration on PCBs, beneficial for modern electronics.

Temperature Grade: MILITARY

MILITARY-grade temperature qualification ensures high reliability and performance in critical applications.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, making it efficient for many applications.

Terminal Form: GULL WING

The gull wing terminal form allows for easy mounting and reliable solder joints, simplifying assembly processes.

Packing Method: TR

The Tape & Reel (TR) packing method enables automatic assembly and improves handling efficiency during manufacturing.

Terminal Pitch: 0.95 mm

The 0.95 mm terminal pitch facilitates tighter packing on PCBs while maintaining ease of soldering.

Minimum fmax: 150 MHz

A minimum frequency of 150 MHz allows for high-speed applications, ensuring quick data processing.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V provides a safe operating range, protecting the device from overvoltage conditions.

Technical Specifications

Latches & Flip-Flops 74V1T80STR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

1.625 mm

Minimum fmax:

150 MHz

Trade Compliance

74V1T80STR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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