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74V1T79CTR

STMicroelectronics

74V1T79CTR by STMicroelectronics

74V1T79CTR by STMicroelectronics is a CMOS latch with an 8.5 ns propagation delay, ideal for high-speed applications. It operates at a nominal voltage of 5V and supports temperatures from -55 °C to 125°C. Its compact design makes it suitable for space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,157 parts In-Stock

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Digiode

USA . 2,498 parts In-Stock

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2,498

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Anansix

USA . 1,547 parts In-Stock

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1,547

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Distributors (Availability)

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Native Components

USA . 690 parts In-Stock

1+ parts

$1.040

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-

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690

$1.040

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Northwest PG Solutions

USA . 80 parts In-Stock

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$1.144

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80

$1.144

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IDEA Electronic Components Group

UK . 668 parts In-Stock

1+ parts

$7.669

100+ parts

-

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$6.902

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668

$7.669

-

$6.902

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MKK Technologies

India . 1,157 parts In-Stock

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$14.421

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1,157

$14.421

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DigiPath Technology Company

USA . 1,157 parts In-Stock

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$14.421

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1,157

$14.421

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Corphita

USA . 4,132 parts In-Stock

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Kepictronics

USA . 4,000 parts In-Stock

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4,000

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Parana Technologies

USA . 123 parts In-Stock

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$9.170

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123

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$9.170

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Overview

Unlock unparalleled performance with the 74V1T79CTR from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This high-quality latch delivers exceptional speed and efficiency for your applications, making it ideal for communication systems, automotive electronics, and industrial controls. Designed for reliability, its compact footprint ensures seamless integration while maximizing power efficiency. Elevate your projects with the unmatched durability and precision that only STMicroelectronics can provide!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 8.5 ns

A low propagation delay enhances performance in high-speed digital applications, ensuring faster signal processing.

Surface Mount: YES

Surface mount capability allows for efficient use of PCB space and facilitates automated assembly processes.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout and design flexibility on printed circuit boards.

Nominal Supply Voltage / Vsup (V): 5

A nominal supply voltage of 5V is standard for many digital circuits, making integration into existing systems straightforward.

Load Capacitance (CL): 50 pF

A moderate load capacitance supports reliable operation in various electronic systems, ensuring stable performance.

Power Supplies (V): 5

The consistent 5V power supply requirement simplifies design and enhances compatibility with many components.

No. of Terminals: 5

Having 5 terminals allows for versatile connectivity options, making it adaptable to different circuit configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile are ideal for compact designs, making this component suitable for space-constrained applications.

Maximum I (ol): 8 Amp

An output current of up to 8 Amps indicates strong driving capabilities for controlling larger loads.

Propagation Delay (tpd): 8.5 ns

The 8.5 ns propagation delay ensures minimal latency, which is critical for time-sensitive applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature makes the product suitable for harsh environments, ensuring reliability under thermal stress.

Trigger Type: POSITIVE EDGE

The positive edge trigger type enables precise timing control for event synchronization in digital circuits.

Minimum Operating Temperature: -55 °C

A wide operating temperature range (-55 °C to 125°C) is ideal for military and aerospace applications where temperature extremes are common.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides excellent solderability and resistance to oxidation, enhancing assembly reliability.

Terminal Position: DUAL

Dual terminal positions allow for flexible mounting options in various PCB layouts.

Maximum Seated Height: 1.1 mm

A low seated height is advantageous in low-profile designs, increasing compatibility with compact systems.

Width: 1.25 mm

The narrow width enables integration into dense circuit designs, maintaining overall compactness.

Output Polarity: TRUE

True output polarity supports straightforward integration into designs without requiring inverting stages.

Minimum Supply Voltage (Vsup): 4.5 V

A lower minimum supply voltage makes the product adaptable to a variety of power conditions.

Maximum Time At Peak Reflow Temperature (s): 30

The capability to withstand peak reflow conditions enhances reliability during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures compatibility with modern soldering techniques.

Length: 2 mm

Compact length optimizes space on a PCB, facilitating design in smaller electronics.

Temperature Grade: MILITARY

MIL-STD temperature grading ensures the product meets stringent military standards, enhancing reliability in critical applications.

Technology: CMOS

CMOS technology allows for low power consumption and high-speed operation, which is beneficial in battery-powered devices.

Terminal Form: GULL WING

Gull-wing terminals facilitate easier soldering and better mechanical integrity on PCBs.

Packing Method: TR

Tape and reel packing is ideal for automated assembly, improving production efficiency.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch supports high-density designs, optimizing space usage on PCBs.

Minimum fmax: 120 MHz

A minimum frequency of 120 MHz allows for high-speed applications, ensuring performance in demanding scenarios.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V provides design flexibility within the specified operating range.

Technical Specifications

Latches & Flip-Flops 74V1T79CTR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

8.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

1.25 mm

Minimum fmax:

120 MHz

Trade Compliance

74V1T79CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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