Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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74V1T79CTR by STMicroelectronics is a CMOS latch with an 8.5 ns propagation delay, ideal for high-speed applications. It operates at a nominal voltage of 5V and supports temperatures from -55 °C to 125°C. Its compact design makes it suitable for space-constrained environments.
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The plastic/epoxy material provides durability and resistance to environmental factors, making the product suitable for various applications.
A low propagation delay enhances performance in high-speed digital applications, ensuring faster signal processing.
Surface mount capability allows for efficient use of PCB space and facilitates automated assembly processes.
The rectangular shape optimizes layout and design flexibility on printed circuit boards.
A nominal supply voltage of 5V is standard for many digital circuits, making integration into existing systems straightforward.
A moderate load capacitance supports reliable operation in various electronic systems, ensuring stable performance.
The consistent 5V power supply requirement simplifies design and enhances compatibility with many components.
Having 5 terminals allows for versatile connectivity options, making it adaptable to different circuit configurations.
The small outline and thin profile are ideal for compact designs, making this component suitable for space-constrained applications.
An output current of up to 8 Amps indicates strong driving capabilities for controlling larger loads.
The 8.5 ns propagation delay ensures minimal latency, which is critical for time-sensitive applications.
A high maximum operating temperature makes the product suitable for harsh environments, ensuring reliability under thermal stress.
The positive edge trigger type enables precise timing control for event synchronization in digital circuits.
A wide operating temperature range (-55 °C to 125°C) is ideal for military and aerospace applications where temperature extremes are common.
Matte tin finish provides excellent solderability and resistance to oxidation, enhancing assembly reliability.
Dual terminal positions allow for flexible mounting options in various PCB layouts.
A low seated height is advantageous in low-profile designs, increasing compatibility with compact systems.
The narrow width enables integration into dense circuit designs, maintaining overall compactness.
True output polarity supports straightforward integration into designs without requiring inverting stages.
A lower minimum supply voltage makes the product adaptable to a variety of power conditions.
The capability to withstand peak reflow conditions enhances reliability during manufacturing.
High peak reflow temperature tolerance ensures compatibility with modern soldering techniques.
Compact length optimizes space on a PCB, facilitating design in smaller electronics.
MIL-STD temperature grading ensures the product meets stringent military standards, enhancing reliability in critical applications.
CMOS technology allows for low power consumption and high-speed operation, which is beneficial in battery-powered devices.
Gull-wing terminals facilitate easier soldering and better mechanical integrity on PCBs.
Tape and reel packing is ideal for automated assembly, improving production efficiency.
A 0.65 mm terminal pitch supports high-density designs, optimizing space usage on PCBs.
A minimum frequency of 120 MHz allows for high-speed applications, ensuring performance in demanding scenarios.
The maximum supply voltage of 5.5V provides design flexibility within the specified operating range.
Latches & Flip-Flops 74V1T79CTR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics
Family:
JESD-30 Code:
JESD-609 Code:
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Peak Reflow Temperature (C):
Power Supplies (V):
Propagation Delay At Nominal Supply:
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74V1T79CTR Logic ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
LL4148
Microsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM555CN
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
2N7002
Continental Device India
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; Package Body Material: PLASTIC/EPOXY; JEDEC-95 Code: TO-236AB;
2N2222A
Tt Electronics Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
BSS138
Yangzhou Yangjie Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Operating Mode: ENHANCEMENT MODE;
BSS138-7-F
Diodes Incorporated
Diodes Inc. BSS138-7-F is a N-channel FET with 50V DS breakdown voltage, 0.2A max drain current, and 3.5 ohm RDS(on). Ideal for switching applications in small outline packages with matte tin finish, operating up to 150°C peak reflow temp.
1N4148WS
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CGA3E2X7R1H104K080AA
TDK
CGA3E2X7R1H104K080AA by TDK is a fixed ceramic capacitor with a capacitance of 0.1 uF and a rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate at temperatures ranging from -55 to 125 °C. This capacitor is commonly used in surface mount applications for various electronic devices.
Jiangsu Changjiang Electronics Technology
SMBJ18CA
Fagor Electronica S Coop
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/58-360
Carlisle Interconnect Technologies
GENERAL CONN ACCESSORY; Associated Military - Specifications: MIL-C-55302/69, MIL-C-38999; Maximum Operating Temperature: 200 Cel; MIL-Connector Accessory: CONTACT; Terminal Type: CRIMP; MIL Conformity: YES;
BSS123-7-F
BSS123-7-F by Diodes Inc. is a N-channel FET with 100V DS breakdown voltage and 0.17A drain current. Ideal for switching applications, it features a single configuration with built-in diode, operates in enhancement mode, and has a max power dissipation of 0.3W.
LM358MX
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
Transpro Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; JESD-609 Code: e0; Terminal Finish: Tin/Lead (Sn/Pb); Nominal Breakdown Voltage: 21.1 V; Maximum Clamping Voltage: 29.2 V;
CRGCQ0805F10K
TE Connectivity
TE Connectivity's CRGCQ0805F10K is a 10000 ohm fixed resistor with 1% tolerance. It operates b/w -55 to 155 °C and has a power dissipation of 0.125 W. Ideal for surface mount applications in automotive electronics due to AEC-Q200 standard compliance.
Tri-star Electronics International
CONNECTOR ACCESSORY; Material: COPPER ALLOY; MIL Conformity: YES; Associated Military - Specifications: MIL-C-55302/69, MIL-C-38999; MIL-Connector Accessory Name: CONTACT; Terminal Type: CRIMP;
Rectron
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Package Shape: ROUND;
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 40; Minimum DS Breakdown Voltage: 60 V;
Inter F E T
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 7.5 ohm; Maximum Drain Current (Abs) (ID): .115 A;
1N4148
Capar Components
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Forward Voltage (VF): 1 V; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Output Current: .15 A;
CD4013BPWRE4
Texas Instruments
CD4013BPWRE4 by Texas Instruments is a CMOS latches & flip-flops IC with 2 functions, 300 ns propagation delay at 5V. It operates b/w -55 to 125°C, suitable for military applications. With a small outline package and surface mount capability, it offers high-speed performance up to 3.5 MHz.
CD74HCT73M96
CD74HCT73M96 by Texas Instruments is a dual-function latches & flip-flops IC with 2 bits, operating at a supply voltage of 4.5V to 5.5V. It features a propagation delay of 57ns, output polarity as complementary, and can handle a max I (ol) of 6A. Ideal for military-grade applications requiring negative edge triggering and operating temperatures ranging from -55°C to 125°C.
CD74AC112M
Thomson Consumer Electronics
J-K FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
CD74HC273E
D FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;
74LCX74MTC
Onsemi
74LCX74MTC by Onsemi is a dual-function latches & flip-flops IC with 7ns propagation delay at 2.5V. It operates at a max frequency of 150MHz, suitable for industrial applications requiring positive edge triggering and complementary output polarity. This CMOS technology device comes in a small outline package with surface mount capability.
CD4027BEE4
CD4027BEE4 by Texas Instruments is a CMOS latches & flip-flops IC with 2 functions, 130ns propagation delay at 5V. It has a max frequency of 3.5MHz and operates b/w -55°C to 125°C. Ideal for military-grade applications requiring positive edge triggering and complementary output polarity.
SN74LVC74APWRE4
SN74LVC74APWRE4 by Texas Instruments is a dual-function latch with 5.2ns propagation delay and 1.8V nominal voltage, ideal for automotive applications. It features complementary output polarity, operates at temperatures from -40 to 125°C, and has a max frequency of 150MHz. This surface-mount device in a small outline package is designed for high-speed signal processing in automotive electronics.
CD4044BDT
CD4044BDT by Texas Instruments is a 4-bit latch with 140ns propagation delay, suitable for military applications. It operates at 5V with 50pF load capacitance and features a max operating temperature of 125°C. This CMOS technology flip-flop has a small outline package style and supports surface mount installation.
74AUP1G374GW
Nexperia
D FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
SN74HC74DR
SN74HC74DR by Texas Instruments is a dual latches & flip-flops IC with 2 functions, operating at 5V. It has a propagation delay of 220ns and can handle load capacitance of 50pF. Ideal for industrial applications requiring positive edge triggering, this CMOS technology chip comes in a small outline package with surface mount capability.
CD40175BE
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
CD4044BE
Harris Semiconductor
R-S LATCH; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
74VHC74MTCX
74VHC74MTCX by Onsemi is a dual-function latches & flip-flops IC with a propagation delay of 10.5 ns at 3.3V, suitable for industrial applications. It operates on a supply voltage range of 2-5.5V, has a max frequency of 75MHz, and features positive edge triggering. This CMOS technology chip comes in a small outline package with surface mount capability.
74LVC2G74DP,125
D FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;
CD74HC573M96
Intersil
D LATCH; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;
HEF4013BT-Q100J
D FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
SN74HC74PWLE
SN74HC74PWLE by Texas Instruments is a dual latches & flip-flops IC with 2 functions, operating at 5V. It features a propagation delay of 220ns, max frequency of 25MHz, and can handle load capacitance of 50pF. Ideal for industrial applications requiring positive edge triggering in a compact SOT package.
SN74ACT74PWRE4
SN74ACT74PWRE4 by Texas Instruments is a dual-function latches & flip-flops IC with 5V nominal voltage, 50pF load capacitance, and 13ns propagation delay. It is ideal for industrial applications requiring positive edge triggering at temperatures ranging from -40 to 85°C.
74LVC2G74DC-Q100H
NXP Semiconductors
NXP Semiconductors' 74LVC2G74DC-Q100H is a CMOS latch with 5.9 ns propagation delay, suitable for automotive applications. It operates at 1.8V nominal voltage and has a max frequency of 175MHz, making it ideal for high-speed signal processing in compact designs. With AEC-Q100 screening level and small outline package style, this flip-flop offers reliable performance in harsh environments.
CD4043BE
CD4043BE by Texas Instruments is a 4-bit latch with 140 ns propagation delay at 5V. It features a 3-STATE output and operates in temperatures ranging from -55 to 125°C. Ideal for military applications due to its CMOS technology and through-hole terminal form.
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74V1G77CTR
STMicroelectronics
D LATCH; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 5; Package Code: TSSOP; Package Shape: RECTANGULAR;
74V1G77STR
D LATCH; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 5; Package Code: LSSOP; Package Shape: RECTANGULAR;
74V1G79CTR
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 5; Package Code: TSSOP; Package Shape: RECTANGULAR;
74V1G79STR
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 5; Package Code: LSSOP; Package Shape: RECTANGULAR;
74V1G80CTR
74V1G80STR
74V1T77CTR
74V1T77STR
74V1T79STR
74V1T80CTR
74V1T80STR
Supply Digital Components
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