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74V1G79STR

STMicroelectronics

74V1G79STR by STMicroelectronics

74V1G79STR by STMicroelectronics is a CMOS latch with an 11 ns propagation delay, operating b/w 2-5.5 V. It features a compact low-profile design and supports military-grade temperatures from -55 °C to 125°C. Ideal for high-speed applications in space-constrained environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Vyrian

USA . 6,293 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 6,000 parts In-Stock

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Digiode

USA . 3,752 parts In-Stock

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Semi Source

USA . 2,873 parts In-Stock

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Prism Electronics

USA . 1,863 parts In-Stock

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Bristol Electronics

USA . 1,483 parts In-Stock

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Dan-Mar Components

USA . 1,483 parts In-Stock

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Anansix

USA . 916 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 447 parts In-Stock

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$1.988

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447

$1.988

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AZTECH Wire

Italy . 1,151 parts In-Stock

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$8.960

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$8.960

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IDEA Electronic Components Group

UK . 2,086 parts In-Stock

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$29.866

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$26.879

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MKK Technologies

India . 308 parts In-Stock

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$56.161

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DigiPath Technology Company

USA . 308 parts In-Stock

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$56.161

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Native Components

USA . 677 parts In-Stock

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$331.440

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$324.811

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$321.497

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$318.182

677

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$324.811

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$318.182

Northwest PG Solutions

USA . 962 parts In-Stock

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$364.584

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Perfect Parts

USA . 22,991 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 6,000 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Glotronic Ltd.

UK . 4,800 parts In-Stock

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Infinite Electronics LLP (Excess)

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GreenTree Electronics

Israel . 1,990 parts In-Stock

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Parana Technologies

USA . 1,897 parts In-Stock

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$35.709

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Technoshack Inc. (Excess)

Canada . 1,690 parts In-Stock

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Corphita

USA . 1,177 parts In-Stock

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Overview

Unlock the potential of your designs with the 74V1G79STR from STMicroelectronics—a reliable choice in latches and flip-flops that combines top-tier quality with exceptional performance. Ideal for a variety of applications, this low-profile component ensures swift data handling with minimal power consumption, seamlessly fitting into compact spaces. Trust in STMicroelectronics' industry-leading innovation to elevate your projects and gain a competitive edge.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures reliability and protection against environmental factors, making this latch or flip-flop suitable for various applications.

Propagation Delay At Nominal Supply: 11 ns

A low propagation delay signifies fast switching times, allowing for high-speed operations in digital circuits.

Surface Mount: YES

Surface mount compatibility enhances compact design possibilities and integration into modern electronic circuits.

Package Shape: RECTANGULAR

The rectangular shape is ideal for efficient board layout and space-saving in designs.

Nominal Supply Voltage / Vsup: 3.3 V

Operating at a nominal supply voltage of 3.3 V makes it compatible with most modern low-voltage systems, reducing power consumption.

Load Capacitance (CL): 50 pF

A manageable load capacitance helps maintain performance without excessive power drain, making it ideal for high-frequency applications.

Power Supplies (V): 2/5.5 V

Dual voltage supply options increase flexibility for use in various designs and applications.

No. of Terminals: 5

Five terminals provide adequate connectivity for efficient circuit integration, simplifying connections in designs.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

This package style is optimized for space-saving, allowing for more compact and lightweight circuit designs.

Maximum I (ol): 4 Amp

A maximum output current of 4 Amp enables the drive of substantial loads, enhancing versatility in applications.

Propagation Delay (tpd): 11 ns

Consistent propagation delay performance contributes to reliable timing in digital circuits, minimizing signal delay.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliable performance even in elevated thermal environments, suitable for military and industrial applications.

Trigger Type: POSITIVE EDGE

Positive edge triggering is ideal for synchronization in digital circuits, providing precise control over circuit state transitions.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature, this product is suitable for extreme conditions, ensuring reliability in harsh environments.

Terminal Finish: MATTE TIN

Matte tin finish offers excellent solderability and long-term reliability, enhancing connection integrity over time.

Terminal Position: DUAL

Dual terminal position allows flexibility in circuit board layouts, accommodating various design configurations.

Maximum Seated Height: 1.45 mm

A low seated height contributes to a slim profile, ideal for applications where space and height constraints are critical.

Width: 1.625 mm

Compact width makes this product suitable for densely packed electronic designs, optimizing PCB space utilization.

Output Polarity: TRUE

True output polarity enhances ease of integration into existing designs and simplifies signal interpretation.

Minimum Supply Voltage (Vsup): 2 V

Operating down to 2 V provides flexibility for low-voltage designs, enhancing energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow duration of 30 seconds minimizes the risk of thermal damage during the manufacturing process.

Peak Reflow Temperature °C: 260

The ability to withstand high peak reflow temperatures ensures compatibility with standard surface mount processes.

Length: 2.9 mm

The compact length contributes to effective PCB layout, making it suitable for miniaturized electronic devices.

Temperature Grade: MILITARY

Military-grade temperature classification ensures reliability in extreme conditions and rigorous applications.

Technology: CMOS

CMOS technology allows for low power consumption while maintaining high speed, ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals facilitate automated assembly processes and ensure stable mechanical connections.

Packing Method: TR

Tape and reel packing method enables convenient handling and efficient automated placement during manufacturing.

Terminal Pitch: 0.95 mm

A terminal pitch of 0.95 mm is standard for many modern components, simplifying integration into existing designs.

Minimum fmax: 150 MHz

Minimum frequency capability of 150 MHz supports high-speed digital applications, making it valuable for modern technology.

Maximum Supply Voltage (Vsup): 5.5 V

Support for a maximum supply voltage of 5.5 V allows for compatibility with a wide range of electronic systems.

Technical Specifications

Latches & Flip-Flops 74V1G79STR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

1.625 mm

Minimum fmax:

150 MHz

Trade Compliance

74V1G79STR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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