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74V1G77STR

STMicroelectronics

74V1G77STR by STMicroelectronics

74V1G77STR by STMicroelectronics is a CMOS latch with a supply voltage range of 2-5.5V and a fast propagation delay of just 13 ns. It operates in extreme temperatures from -55 °C to 125°C, making it ideal for military applications. Its compact design features a low-profile, rectangular package suitable for surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,676 parts In-Stock

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6,676

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Digiode

USA . 1,176 parts In-Stock

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Anansix

USA . 912 parts In-Stock

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Diverse Electronics

Canada . 866 parts In-Stock

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Prism Electronics

USA . 49 parts In-Stock

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49

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Distributors (Availability)

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Native Components

USA . 891 parts In-Stock

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$0.950

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891

$0.950

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Northwest PG Solutions

USA . 1,969 parts In-Stock

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$1.045

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1,969

$1.045

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Microchip USA

USA . 114 parts In-Stock

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$4.824

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114

$4.824

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AZTECH Wire

Italy . 386 parts In-Stock

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$11.620

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386

$11.620

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IDEA Electronic Components Group

UK . 702 parts In-Stock

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$23.679

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$21.311

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702

$23.679

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$21.311

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Ampacity Inc.

Singapore . 1,046 parts In-Stock

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$32.000

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1,046

$32.000

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MKK Technologies

India . 977 parts In-Stock

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$44.527

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977

$44.527

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DigiPath Technology Company

USA . 977 parts In-Stock

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$44.527

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977

$44.527

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QUARKTWIN TECHNOLOGY LTD

USA . 10,328 parts In-Stock

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Parana Technologies

USA . 1,854 parts In-Stock

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$28.312

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Corphita

USA . 681 parts In-Stock

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Robosynatics

Brazil . 500 parts In-Stock

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Lucentia Tech

USA . 500 parts In-Stock

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$27.227

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$25.212

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$25.212

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$25.212

$25.212

Perfect Parts

USA . 55 parts In-Stock

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Overview

Elevate your designs with the 74V1G77STR from STMicroelectronics, a robust latch and flip-flop solution that promises reliability and performance. Engineered for versatility, this high-quality component thrives in demanding environments, supporting a wide voltage range and operating temperatures. Its compact design ensures seamless integration into your projects, delivering exceptional speed and efficiency—perfect for automotive, industrial, and consumer applications. Trust in the pedigree of STMicroelectronics to enhance your innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers good mechanical durability and thermal stability, making the product reliable in various applications.

Surface Mount: YES

Surface mount capability ensures compact designs and facilitates automated assembly, reducing production costs.

Package Shape: RECTANGULAR

The rectangular package shape is space-efficient and conducive to high-density circuit board designs.

Nominal Supply Voltage / Vsup: 3.3 V

Operating at a nominal voltage of 3.3 V aligns with standard logic levels in many modern digital circuits.

Power Supplies (V): 2/5.5

Support for a supply range of 2 to 5.5 V enhances flexibility for various applications, accommodating diverse system designs.

No. of Terminals: 5

With 5 terminals, the device allows for sufficient connectivity while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

This low-profile package style minimizes space usage on printed circuit boards, ideal for compact electronic devices.

Maximum I (ol): 4 Amp

The maximum output current of 4 A supports robust signal drive capability, suitable for demanding applications.

Propagation Delay (tpd): 13 ns

A propagation delay of 13 ns indicates fast switching speeds, enhancing the performance of high-speed digital circuits.

Maximum Operating Temperature: 125 °C

The high operating temperature range ensures reliability in extreme environments, making this product suitable for military and industrial applications.

Trigger Type: HIGH LEVEL

The high-level trigger type is advantageous for compatibility with standard logic signals in many digital systems.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures functionality in harsh, cold environments, making it ideal for military applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and resistance to corrosion, enhancing the longevity of the connections.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in board layout, accommodating various design requirements.

Maximum Seated Height: 1.45 mm

A maximum seated height of 1.45 mm allows for low-profile designs, essential for compact device applications.

Width: 1.625 mm

The narrow width facilitates space-saving designs while ensuring compatibility with standard PCB layouts.

Output Polarity: TRUE

True output polarity ensures simple integration into standard logic circuits and devices.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage requirement ensures compatibility with a wide range of battery-operated devices.

Maximum Time At Peak Reflow Temperature: 30 s

Limited time at peak reflow temperature minimizes damage during soldering, guaranteeing component reliability.

Peak Reflow Temperature: 260 °C

A peak reflow temperature of 260 °C is suitable for modern lead-free solder processes, ensuring compatibility with current manufacturing practices.

Length: 2.9 mm

Compact length aids in minimizing PCB real estate usage, valuable in space-constrained applications.

Temperature Grade: MILITARY

The military temperature grade indicates robustness against environmental stresses, ideal for demanding applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency in designs.

Terminal Form: GULL WING

The gull wing terminal form is common for surface mount technologies, facilitating easy and reliable soldering.

Terminal Pitch: 0.95 mm

A terminal pitch of 0.95 mm optimizes space while ensuring reliability in signal integrity across connections.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5 V allows integration into higher voltage systems, increasing the versatility of applications.

Technical Specifications

Latches & Flip-Flops 74V1G77STR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

HIGH LEVEL

Width:

1.625 mm

Trade Compliance

74V1G77STR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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