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74V1G70CTR

STMicroelectronics

74V1G70CTR by STMicroelectronics

74V1G70CTR by STMicroelectronics is a CMOS logic gate with a propagation delay of just 10 ns and operates b/w 2-5.5 V. It features a compact SOIC package, ideal for space-constrained applications. With a max temp of 125 °C, it's suitable for military use.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

ComSIT Distribution GmbH

Germany . 6,000 parts In-Stock

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6,000

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Digiode

USA . 3,091 parts In-Stock

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3,091

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Vyrian

USA . 2,191 parts In-Stock

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Anansix

USA . 335 parts In-Stock

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335

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Native Components

USA . 88 parts In-Stock

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$0.560

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88

$0.560

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Northwest PG Solutions

USA . 1,629 parts In-Stock

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$0.616

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1,629

$0.616

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Microchip USA

USA . 280 parts In-Stock

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$2.828

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280

$2.828

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AZTECH Wire

Italy . 739 parts In-Stock

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$19.520

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739

$19.520

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IDEA Electronic Components Group

UK . 427 parts In-Stock

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$29.578

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$26.620

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427

$29.578

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MKK Technologies

India . 36 parts In-Stock

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$55.620

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36

$55.620

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DigiPath Technology Company

USA . 36 parts In-Stock

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$55.620

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36

$55.620

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A-Z Elektronik GmbH

Germany . 5,822 parts In-Stock

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Kepictronics

USA . 3,199 parts In-Stock

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Parana Technologies

USA . 1,995 parts In-Stock

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$35.365

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$35.365

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Corphita

USA . 286 parts In-Stock

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Overview

Elevate your designs with the 74V1G70CTR from STMicroelectronics, a leader in innovative logic solutions. This high-quality component promises reliability and efficiency, seamlessly integrating into various applications such as telecommunications and automotive systems. Boasting a compact design and low power consumption, it empowers engineers to create smarter, faster devices without compromising on performance or space. Choose STMicroelectronics for unparalleled quality and trustworthiness in your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides a durable and lightweight package, ensuring reliability in various applications.

Propagation Delay At Nominal Supply: 10 ns

With a low propagation delay, this logic gate offers fast switching speeds, enhancing overall circuit performance.

Surface Mount: YES

Surface mount capability allows for compact designs and easier integration into modern electronics.

Package Shape: RECTANGULAR

The rectangular shape optimizes board space utilization, facilitating high-density layout designs.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a low nominal voltage of 3.3V makes it suitable for power-efficient applications.

Load Capacitance (CL): 50 pF

The low load capacitance allows for faster signal transitions, improving circuit response times.

Power Supplies (V): 2/5.5

Flexible supply voltage range caters to various applications, making it versatile across different circuit designs.

No. of Terminals: 5

With 5 terminals, this product provides adequate connectivity options while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile make it ideal for space-constrained applications without compromising performance.

Maximum I (ol): 4 Amp

A high output current capability (4A) supports driving larger loads, enhancing its functionality in power management applications.

Propagation Delay (tpd): 10 ns

Consistent propagation delay ensures predictable behavior in time-sensitive applications.

Maximum Operating Temperature: 125 °C

Rated for high operating temperatures, this product is suitable for demanding applications in extreme environments.

Minimum Operating Temperature: -55 °C

The ability to function in very low temperatures enhances its usability in aerospace and military applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish ensures reliable connections and protects against corrosion, enhancing longevity.

Terminal Position: DUAL

Dual terminal positioning allows for flexible layout designs, which can simplify PCB layout.

Maximum Seated Height: 1.1 mm

The low seated height helps maintain a compact assembly profile, ideal for miniature electronic devices.

Width: 1.25 mm

A narrow width enables denser circuit designs and contributes to overall space-saving in device construction.

Minimum Supply Voltage (Vsup): 2 V

Operating down to 2V provides flexibility in power supply options, catering to low-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow time ensures reliable soldering during assembly, critical for maintaining device integrity.

Peak Reflow Temperature °C: 260

The high peak reflow temperature supports compatibility with lead-free solder, aligning with modern manufacturing standards.

Length: 2 mm

A compact length aids in minimizing the overall PCB area, beneficial for high-density designs.

Temperature Grade: MILITARY

Military grade rating guarantees performance reliability under stringent environmental conditions, making it suitable for defense applications.

Technology: CMOS

The use of CMOS technology enables low power consumption and high noise immunity, crucial for modern digital circuits.

Terminal Form: GULL WING

Gull-wing terminals offer excellent soldering characteristics and improve the mechanical bond to the PCB.

Packing Method: TR

Tape and reel packaging facilitates automated assembly processes, enhancing manufacturing efficiency.

Terminal Pitch: 0.65 mm

A fine terminal pitch allows for tighter packing of components, which is essential for advanced electronics design.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum voltage capability of 5.5V provides robustness for a wide variety of applications while maintaining reliability.

Technical Specifications

Logic Gates 74V1G70CTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

10 ns

Propagation Delay (tpd):

10 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74V1G70CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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