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74V1G32STR

STMicroelectronics

74V1G32STR by STMicroelectronics

74V1G32STR by STMicroelectronics is a CMOS logic gate with 2 inputs, 9.5 ns propagation delay, and 3.3 V nominal voltage. It is used in military-grade applications due to its low profile package style and dual terminal position, operating b/w -55 °C to 125°C temperature range.

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Bristol Electronics

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Vyrian

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Digiode

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Anansix

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ComSIT Distribution GmbH

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Martec Srl

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Speed Components Ltd

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Prism Electronics

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South Africa . 15 parts In-Stock

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$0.075

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Native Components

USA . 961 parts In-Stock

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$0.770

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Northwest PG Solutions

USA . 1,366 parts In-Stock

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$0.847

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Microchip USA

USA . 426 parts In-Stock

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IDEA Electronic Components Group

UK . 625 parts In-Stock

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AZTECH Wire

Italy . 691 parts In-Stock

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MKK Technologies

India . 307 parts In-Stock

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DigiPath Technology Company

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Advanced Electronics

New Zealand . 100 parts In-Stock

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Component Stockers USA

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Overview

Discover the unparalleled quality and reliability of the 74V1G32STR by STMicroelectronics, a leading manufacturer in the industry. This logic gate is perfect for a wide range of applications, offering fast propagation delay and low power consumption. With a compact design and high-performance capabilities, this product ensures seamless operation and efficiency. Trust STMicroelectronics to deliver exceptional value and innovation with every component, making the 74V1G32STR the ideal choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Propagation Delay At Nominal Supply: 9.5 ns

Low propagation delay ensures fast operation and efficient signal processing.

Surface Mount: YES

Surface mount technology enables easy and efficient assembly onto PCBs.

No. of Inputs: 2

Suitable for basic logic operations that require two input signals.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard voltage level, ensuring compatibility with most systems.

Load Capacitance (CL): 50 pF

Designed to work efficiently with a standard load capacitance.

Power Supplies (V): 2/5.5

Wide range of power supply options for flexibility in different applications.

No. of Terminals: 5

Simple and straightforward connectivity with a small number of terminals.

Maximum I (ol): 4 Amp

High output current capability for driving loads effectively.

Propagation Delay (tpd): 12 ns

Overall fast propagation delay for quick response times.

Maximum Operating Temperature: 125 °C

Can operate reliably in high-temperature environments.

Minimum Operating Temperature: -55 °C

Wide operating temperature range for versatile use in various conditions.

Terminal Finish: Matte Tin (Sn) - annealed

Durable terminal finish for long-term reliability and solderability.

Terminal Position: DUAL

Dual terminal position for easy installation and connectivity.

Maximum Seated Height: 1.45 mm

Low-profile design for space-saving and compact applications.

Width: 1.625 mm

Small width for fitting into tight spaces or crowded PCB layouts.

Minimum Supply Voltage (Vsup): 2 V

Can operate at low supply voltages for energy-efficient applications.

Maximum Time At Peak Reflow Temperature (s): 30

Able to withstand peak reflow temperatures for reliable soldering.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for manufacturing processes.

Length: 2.9 mm

Compact length for efficient PCB footprint and layout.

Temperature Grade: MILITARY

Designed to meet military-grade standards for rugged and demanding environments.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form for secure and reliable solder connections.

Packing Method: TR

Tape and reel packaging for convenient handling and automated assembly.

Terminal Pitch: 0.95 mm

Fine terminal pitch for high-density mounting on PCBs.

Maximum Supply Voltage (Vsup): 5.5 V

Safe maximum supply voltage for reliable operation and protection of the device.

Technical Specifications

Logic Gates 74V1G32STR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

9.5 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.625 mm

Trade Compliance

74V1G32STR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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