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74LVX74TTR

STMicroelectronics

74LVX74TTR by STMicroelectronics

74LVX74TTR by STMicroelectronics is a dual positive edge-triggered flip-flop with a propagation delay of 15 ns and operates at supply voltages from 2 to 3.6 V. It features a compact SOIC package, ideal for space-constrained applications. With a max operating temp of 125 °C, it's suitable for military-grade use.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,230 parts In-Stock

1+ parts

-

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6,230

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Digiode

USA . 4,193 parts In-Stock

1+ parts

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4,193

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Anansix

USA . 1,133 parts In-Stock

1+ parts

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1,133

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 878 parts In-Stock

1+ parts

$0.224

100+ parts

-

1k+ parts

-

10k+ parts

$0.215

878

$0.224

-

-

$0.215

Northwest PG Solutions

USA . 2,104 parts In-Stock

1+ parts

$0.246

100+ parts

-

1k+ parts

-

10k+ parts

$0.217

2,104

$0.246

-

-

$0.217

Microchip USA

USA . 253 parts In-Stock

1+ parts

$10.289

100+ parts

-

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253

$10.289

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IDEA Electronic Components Group

UK . 2,147 parts In-Stock

1+ parts

$13.192

100+ parts

-

1k+ parts

$11.873

10k+ parts

-

2,147

$13.192

-

$11.873

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AZTECH Wire

Italy . 579 parts In-Stock

1+ parts

$20.010

100+ parts

-

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579

$20.010

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MKK Technologies

India . 1,340 parts In-Stock

1+ parts

$24.806

100+ parts

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1,340

$24.806

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DigiPath Technology Company

USA . 1,340 parts In-Stock

1+ parts

$24.806

100+ parts

-

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-

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1,340

$24.806

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Ampacity Inc.

Singapore . 1,565 parts In-Stock

1+ parts

$36.000

100+ parts

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1,565

$36.000

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Component Stockers USA

USA . 768 parts In-Stock

1+ parts

$99.990

100+ parts

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768

$99.990

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Corphita

USA . 1,983 parts In-Stock

1+ parts

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1,983

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Parana Technologies

USA . 862 parts In-Stock

1+ parts

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100+ parts

$15.773

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862

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$15.773

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Perfect Parts

USA . 96 parts In-Stock

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96

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Overview

Elevate your designs with the 74LVX74TTR from STMicroelectronics, a leader in semiconductor innovation. This high-quality CMOS latch/flip-flop offers exceptional reliability and performance in demanding applications, ensuring seamless integration in communication, automotive, and consumer electronics. With a compact design and robust features, it empowers engineers to achieve their goals efficiently, all while benefiting from ST's commitment to excellence and support. Unlock new possibilities today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures lightweight yet durable construction, ideal for various applications.

Propagation Delay At Nominal Supply: 15 ns

A short propagation delay allows for faster switching speeds, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability enables easy integration into modern PCB designs, saving space and improving assembly efficiency.

No. of Functions: 2

With multiple functions, this latch/flip-flop can reduce component count, helping to simplify circuit designs.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of PCB space and easy alignment during assembly.

Nominal Supply Voltage / Vsup (V): 2.7

This nominal supply voltage ensures compatibility with a broad range of applications, especially in low-power designs.

Load Capacitance (CL): 50 pF

Low load capacitance enhances performance, reducing power consumption and improving response times.

Power Supplies (V): 3.3

Support for a 3.3V power supply makes it ideal for integration in modern digital circuits.

No. of Terminals: 14

The 14-terminal configuration provides versatile connection options for various applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact packaging is suitable for space-constrained applications, offering a sleek design.

Maximum I (ol): 4 Amp

High output current capability (4A) ensures robust performance suitable for demanding applications.

Propagation Delay (tpd): 22 ns

This propagation delay provides reliable performance while maintaining sufficient speed for many applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature rating ensures reliability in harsh environments, suitable for military and industrial use.

Trigger Type: POSITIVE EDGE

Positive edge triggering allows for straightforward synchronization with other digital logic, enhancing system design flexibility.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature ensures functionality in extreme conditions, making it suitable for military applications.

Terminal Finish: MATTE TIN/NICKEL PALLADIUM GOLD

Durable terminal finish enhances solderability and resistance to oxidation, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position allows for flexible layouts, accommodating various design requirements.

Maximum Seated Height: 1.2 mm

Low seated height helps maintain a slim profile, ideal for compact device designs.

Width: 4.4 mm

Narrow width enables space-efficient designs, optimizing PCB layouts without sacrificing performance.

Output Polarity: COMPLEMENTARY

Complementary output polarity allows for versatile output options, suitable for diverse applications.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage expands compatibility with a range of power supply configurations.

Length: 5 mm

Compact length is advantageous for miniaturized electronic applications, fitting into tight spaces.

Temperature Grade: MILITARY

Designed to meet military specifications, ensuring high reliability in critical applications.

Technology: CMOS

CMOS technology allows for low power consumption and high-speed operation, ideal for modern digital circuits.

Terminal Form: GULL WING

Gull wing terminal form enhances soldering reliability, especially for surface-mounted applications.

Packing Method: TR

Tape and reel (TR) packing method facilitates automated assembly processes, improving manufacturing efficiency.

Terminal Pitch: 0.65 mm

Tight terminal pitch reduces space requirements, enabling more components on a PCB.

Minimum fmax: 80 MHz

A minimum frequency of 80 MHz ensures that the device can handle fast clock rates, suitable for high-speed applications.

Maximum Supply Voltage (Vsup): 3.6 V

This high maximum supply voltage accommodates a variety of digital circuits, allowing for flexible usage.

Technical Specifications

Latches & Flip-Flops 74LVX74TTR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3/e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

15 ns

Propagation Delay (tpd):

22 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

80 MHz

Trade Compliance

74LVX74TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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