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74AUP1G04GTR

STMicroelectronics

74AUP1G04GTR by STMicroelectronics

STMicroelectronics' 74AUP1G04GTR is a CMOS logic gate with 16ns propagation delay at 3V, suitable for industrial applications. It has a max operating temperature of 85 °C and can handle load capacitance up to 50pF. This surface-mount device features a flat package style and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 10,316 parts In-Stock

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Anansix

USA . 2,496 parts In-Stock

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Digiode

USA . 354 parts In-Stock

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Native Components

USA . 356 parts In-Stock

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$8.550

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356

$8.550

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Northwest PG Solutions

USA . 1,079 parts In-Stock

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$9.405

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$8.465

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AZTECH Wire

Italy . 537 parts In-Stock

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$18.310

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Microchip USA

USA . 439 parts In-Stock

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$19.013

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IDEA Electronic Components Group

UK . 1,504 parts In-Stock

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$24.924

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$22.431

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Ampacity Inc.

Singapore . 721 parts In-Stock

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$45.000

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MKK Technologies

India . 257 parts In-Stock

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$46.867

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DigiPath Technology Company

USA . 257 parts In-Stock

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$46.867

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Perfect Parts

USA . 6,479 parts In-Stock

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Parana Technologies

USA . 673 parts In-Stock

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$29.800

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Corphita

USA . 543 parts In-Stock

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Overview

Unleash the power of innovation with the 74AUP1G04GTR by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality logic gates that are essential for a wide range of applications. With a compact design and reliable performance, this product offers unmatched value and benefits to customers seeking high-speed signal processing and efficient operation. Elevate your projects with the superior quality and advanced technology of the 74AUP1G04GTR – the ultimate choice for cutting-edge solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that can withstand various environmental conditions.

Propagation Delay At Nominal Supply: 16 ns

Fast response time ensures quick signal processing.

Surface Mount: YES

Easily mountable on PCBs for seamless integration.

Nominal Supply Voltage / Vsup (V): 3

Standard voltage requirement for compatibility with most systems.

Load Capacitance (CL): 50 pF

Can handle a reasonable amount of capacitance for efficient operation.

Power Supplies (V): 1.2/3.3

Flexible power supply options for versatile usage.

No. of Terminals: 6

Sufficient terminals for connecting to other components.

Package Style (Meter): FLATPACK

Compact and space-saving design.

Maximum I (ol): 1 Amp

High output current capability for driving external loads.

Propagation Delay (tpd): 13.3 ns

Low propagation delay for minimal signal lag.

Maximum Operating Temperature: 85 °C

Can operate efficiently in elevated temperatures.

Minimum Operating Temperature: -40 °C

Capable of functioning in cold environments as well.

Terminal Position: DUAL

Dual terminal position for flexible installation options.

Minimum Supply Voltage (Vsup): 1.2 V

Low minimum supply voltage for energy efficiency.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Terminal Form: FLAT

Flat terminal design for easy soldering and connectivity.

Packing Method: TR

Tape and reel packaging for convenient handling and storage.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact layout and space optimization.

Maximum Supply Voltage (Vsup): 3.6 V

Safe maximum supply voltage rating to prevent damage to the device.

Technical Specifications

Logic Gates 74AUP1G04GTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDFP-F6

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

1 Amp

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DFP

Package Equivalence Code:

FL6,.047,20

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TR

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

16 ns

Propagation Delay (tpd):

13.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

74AUP1G04GTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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