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5962-8765004KC

STMicroelectronics

5962-8765004KC by STMicroelectronics

5962-8765004KC by STMicroelectronics is a military-grade EPROM with a max temp of 125 °C and operates asynchronously at 5V. It features a 2048-word capacity, parallel access, and comes in a ceramic, glass-sealed flatpack package. Ideal for reliable data storage in harsh environments.

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

5962-8765004KC by STMicroelectronics
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Digiode

USA . 2,513 parts In-Stock

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2,513

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Anansix

USA . 850 parts In-Stock

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850

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Vyrian

USA . 206 parts In-Stock

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Native Components

USA . 946 parts In-Stock

1+ parts

$0.467

100+ parts

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$0.448

946

$0.467

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$0.448

Northwest PG Solutions

USA . 1,646 parts In-Stock

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$0.514

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$0.453

1,646

$0.514

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$0.453

IDEA Electronic Components Group

UK . 1,459 parts In-Stock

1+ parts

$5.088

100+ parts

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$4.579

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1,459

$5.088

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$4.579

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MKK Technologies

India . 506 parts In-Stock

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$9.567

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506

$9.567

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DigiPath Technology Company

USA . 506 parts In-Stock

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$9.567

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506

$9.567

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Corphita

USA . 1,190 parts In-Stock

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Parana Technologies

USA . 66 parts In-Stock

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$6.083

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$6.083

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Overview

Unlock unparalleled reliability and performance with the 5962-8765004KC EPROM from STMicroelectronics, a trusted name in the industry renowned for its superior quality. Designed to withstand extreme temperatures and rigorous military standards, this robust memory solution is ideal for aerospace, defense, and industrial applications. Experience fast access times and exceptional endurance, ensuring your critical data remains secure and accessible. Elevate your projects with ST’s commitment to excellence!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides enhanced durability and resistance to environmental factors, making the EPROM reliable in harsh conditions.

Surface Mount: YES

Allows for compact design and easier integration into printed circuit boards, saving space and improving manufacturing efficiency.

Screening Level: MIL-STD-883

Meets military standards ensuring high reliability and performance in critical applications, making it suitable for defense and aerospace use.

Package Shape: RECTANGULAR

Standard shape that facilitates easier handling and efficient use of PCB real estate.

Operating Mode: ASYNCHRONOUS

Allows for faster access times and more immediate control over data, which enhances overall system performance.

Nominal Supply Voltage / Vsup: 5V

Common voltage level that is compatible with a wide range of systems, simplifying integration.

No. of Terminals: 24

Provides sufficient connectivity options for a variety of applications while maintaining a compact form factor.

Package Style (Meter): FLATPACK

Flatpack design allows for lower profiles and better thermal management in densely packed circuits.

Maximum Operating Temperature: 125 °C

Enables use in high-temperature environments without compromising performance, expanding its usability range.

Organization: 2KX8

Provides a good balance of memory architecture, enabling efficient data storage and retrieval.

Minimum Operating Temperature: -55 °C

Supports a wide temperature range, making the device reliable in extreme conditions.

Terminal Finish: TIN LEAD

Ensures good solderability and reliable electrical contacts, improving overall product quality.

Terminal Position: DUAL

Facilitates easier routing and connection on PCB, providing design flexibility.

Minimum Supply Voltage (Vsup): 4.5V

Allows operation in environments with variable voltage supply, providing flexibility for different systems.

Temperature Grade: MILITARY

Indicates that the product is built to withstand stringent temperature variations, ensuring reliability in military applications.

Technology: CMOS

Ensures low power consumption and high speed, ideal for energy-efficient applications.

Parallel or Serial: PARALLEL

Offers faster data access speeds due to simultaneous data transfer, enhancing system performance.

Terminal Form: FLAT

Flat terminals facilitate efficient surface mounting and contribute to lower profiles in designs.

No. of Words: 2048 words

Provides a substantial amount of memory space for data storage, suitable for a range of applications.

Memory Width: 8

8-bit width allows for compatibility with various microcontrollers and digital systems, simplifying integration.

No. of Words Code: 2K

Gives sufficient memory addressing for diverse applications, catering to a variety of needs.

Maximum Supply Voltage (Vsup): 5.5V

Offers flexibility in system design, allowing for a margin in voltage supply without risk of damage.

Memory Density: 16384 bit

Provides a balanced memory capacity for numerous application requirements, enhancing functionality.

Memory IC Type: UVPROM

Allows for reprogramming using UV light, making it reusable and cost-efficient over time.

Maximum Access Time: 45 ns

Fast access time ensures quick data retrieval, making it suitable for high-speed applications.

Technical Specifications

EPROM 5962-8765004KC attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

45 ns

JESD-30 Code:

R-GDFP-F24

JESD-609 Code:

e0

Memory Density:

16384 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

24

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

2KX8

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

FLAT

Terminal Position:

DUAL

Trade Compliance

5962-8765004KC Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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