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STK672-442BN-E

Onsemi

STK672-442BN-E by Onsemi

STK672-442BN-E by Onsemi is a Motion Control IC with 19 terminals, operating at 5V. It features a max output current of 20A and uses HYBRID technology. Ideal for STEPPER MOTOR CONTROL applications due to its flange mount package style and zig-zag terminal position.

Median Price

$14.040

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Flip Electronics

USA . 1,036 parts In-Stock

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$14.040

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Vyrian

USA . 7,774 parts In-Stock

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Digiode

USA . 2,122 parts In-Stock

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Vigor

Singapore . 1,605 parts In-Stock

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$8.830

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AZTECH Wire

Italy . 962 parts In-Stock

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TANS Electronics

Latvia . 8,015 parts In-Stock

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Problanco Electronics

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Kulean Microsystems

USA . 3,633 parts In-Stock

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SupplyDigital Components

Austria . 1,681 parts In-Stock

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UHIMA Technologies

Türkiye . 883 parts In-Stock

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Corphita

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Corohmni

South Africa . 99 parts In-Stock

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Overview

Unlock unparalleled precision and efficiency with the STK672-442BN-E by Onsemi, a cutting-edge Motion Control IC designed to revolutionize the way you approach stepper motor control. Manufactured by the industry-leading Onsemi, this innovative product boasts unrivaled quality and reliability. Ideal for a wide range of applications, this Motion Control IC offers customers exceptional value, superior performance, and unmatched benefits. Take your projects to the next level with the STK672-442BN-E and experience the advantages of seamless motion control like never before.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular shape allows for efficient space utilization in electronic circuit designs.

Nominal Supply Voltage (Vsup): 5 V

Standard voltage supply for ease of integration with other components in the system.

No. of Terminals: 19

Sufficient number of terminals for connections and control inputs for a stepper motor controller.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides ease of mounting and secure installation in electronic systems.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish offers good solderability and reliability in varied operating conditions.

Terminal Position: ZIG-ZAG

Zig-zag terminal arrangement aids in better routing of connections and minimizing interference.

Other IC type: STEPPER MOTOR CONTROLLER

Specifically designed as a stepper motor controller for precise movement control applications.

Minimum Supply Voltage (Vsup): 4.75 V

Allows for operation under lower supply voltages for flexibility in power source selection.

Maximum Output Current: 20 A

High output current capability for driving stepper motors with varying power requirements.

Technology: HYBRID

Hybrid technology combines advantages of different technologies for enhanced performance and efficiency.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure mechanical connections and ease of soldering during assembly.

Maximum Supply Voltage (Vsup): 5.25 V

Higher maximum supply voltage tolerance for increased reliability in voltage fluctuation scenarios.

Technical Specifications

Motion Control ICs STK672-442BN-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

ALSO OPERATES IN 0 TO 46V SUPPLY

Other IC type:

JESD-30 Code:

R-XZFM-T19

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

19

Maximum Output Current:

20 A

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Technology:

HYBRID

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

ZIG-ZAG

Trade Compliance

STK672-442BN-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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