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SPI335-54

Onsemi

SPI335-54 by Onsemi

SPI335-54 by Onsemi is a Linear Position Sensor with VCEsat of 0.5V, Response Time of 5us, and Max Output Voltage of 20V. Ideal for applications requiring precise gap sensing in environments ranging from -20 °C to 80°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 2,364 parts In-Stock

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Digiode

USA . 611 parts In-Stock

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ComSIT Distribution GmbH

Germany . 390 parts In-Stock

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ComSIT USA

USA . 390 parts In-Stock

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TANS Electronics

Latvia . 6,941 parts In-Stock

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Problanco Electronics

Mexico . 6,130 parts In-Stock

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Kulean Microsystems

USA . 4,226 parts In-Stock

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Kepictronics

USA . 1,200 parts In-Stock

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Corphita

USA . 957 parts In-Stock

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UHIMA Technologies

Türkiye . 711 parts In-Stock

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SupplyDigital Components

Austria . 675 parts In-Stock

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Corohmni

South Africa . 174 parts In-Stock

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Overview

Enhance your products with precision and reliability using the SPI335-54 Linear Position Sensor by Onsemi. Manufactured by a trusted industry leader, this sensor offers unparalleled quality and performance for a wide range of applications. From automotive to industrial machinery, this sensor provides accurate position feedback with a fast response time. Increase the efficiency of your systems and ensure optimal product performance with the SPI335-54 from Onsemi.

Feature Benefit Bullets

Maximum VCEsat: 0.5 V

Low VCEsat ensures minimal power loss and high efficiency in operation.

Output Circuit Type: Transistor

Transistor output circuit provides reliable and accurate signal output.

Maximum Operating Temperature: 80 °C

Wide operating temperature range allows for use in various environmental conditions.

Response Time: 5 us

Fast response time enables quick and precise feedback for position sensing.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature ensures functionality in colder environments.

Maximum Output Voltage: 20 V

High output voltage capability allows for compatibility with different systems.

Maximum Operating Current: 50 mA

Low operating current helps in saving power and extends product lifespan.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting provides secure installation and easy maintenance.

Gap Size: 0.001 mm

Very small gap size ensures accurate and precise measurement of linear position.

Technical Specifications

Linear Position Sensors SPI335-54 attributes and parameters. Explore more Linear Position Sensors devices from Onsemi

Specs

Gap Size:

.001 mm

Mounting Feature:

No. of Channels:

1

Maximum Operating Current:

50 mA

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Output Circuit Type:

Transistor

Maximum Output Voltage:

20 V

Response Time:

5 us

Sub-Category:

Position, Linear, Photoelectric Sensors

Maximum VCEsat:

.5 V

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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