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SPI335-15

Onsemi

SPI335-15 by Onsemi

SPI335-15 by Onsemi is a Linear Position Sensor with Max VCEsat of 1.2V, Darlington Output Circuit Type, and Response Time of 100us. Ideal for applications requiring precise position sensing in environments ranging from -20 °C to 80°C.

Median Price

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Lifecycle Status

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Digiode

USA . 2,338 parts In-Stock

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Problanco Electronics

Mexico . 6,810 parts In-Stock

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TANS Electronics

Latvia . 4,870 parts In-Stock

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Kulean Microsystems

USA . 3,171 parts In-Stock

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SupplyDigital Components

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Corphita

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UHIMA Technologies

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Corohmni

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Overview

Enhance your industrial applications with the SPI335-15 linear position sensor by Onsemi. Known for their high-quality products, Onsemi delivers precision and reliability in every component. This sensor is perfect for a wide range of applications, offering accurate measurements and fast response times. With a maximum output current of 15 A and maximum operating temperature of 80 °C, this sensor provides unmatched performance. Upgrade your systems today with the SPI335-15 and experience the value and benefits it brings to your projects.

Feature Benefit Bullets

Maximum VCEsat: 1.2 V

Low VCEsat helps in minimizing power losses and improving efficiency of the sensor.

Output Circuit Type: Darlington

Darlington circuit offers high gain and low saturation voltage, providing accurate sensing and reliable operation.

Maximum Operating Temperature: 80 °C

Wide operating temperature range allows the sensor to be used in various environments without performance degradation.

Response Time: 100 us

Fast response time ensures real-time data acquisition and accurate position sensing.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature enables the sensor to function in cold environments without issues.

Maximum Output Voltage: 20 V

High output voltage provides better signal strength and improved noise immunity.

Maximum Operating Current: 50 mA

Low operating current consumption helps in reducing power usage and prolonging battery life.

Maximum Output Current: 15 A

High output current capability allows the sensor to handle heavy loads and ensures reliable operation.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting offers secure installation and mechanical stability for the sensor.

Gap Size: 0.001 mm

Ultra-small gap size allows for precise and accurate sensing of linear positions with high resolution.

Technical Specifications

Linear Position Sensors SPI335-15 attributes and parameters. Explore more Linear Position Sensors devices from Onsemi

Specs

Gap Size:

.001 mm

Mounting Feature:

No. of Channels:

1

Maximum Operating Current:

50 mA

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Output Circuit Type:

Darlington

Maximum Output Current:

15 A

Maximum Output Voltage:

20 V

Response Time:

100 us

Sub-Category:

Position, Linear, Photoelectric Sensors

Maximum VCEsat:

1.2 V

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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