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SPI335-14

Onsemi

SPI335-14 by Onsemi

SPI335-14 by Onsemi is a Linear Position Sensor with VCEsat of 0.5V, Response Time of 5us, and Max Output Current of 1.1A. Ideal for applications requiring precise position sensing in environments ranging from -20 °C to 80°C.

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Digiode

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TANS Electronics

Latvia . 6,106 parts In-Stock

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Problanco Electronics

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Kulean Microsystems

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Corphita

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Overview

Elevate your projects with the SPI335-14 linear position sensor by Onsemi. Crafted with precision and reliability in mind, this sensor offers unparalleled performance for a wide range of applications. From industrial automation to robotics, this sensor's high-quality construction ensures accurate and efficient measurement of linear position. With its low VCEsat and fast response time, this sensor provides value and peace of mind to customers looking for a dependable solution. Upgrade your systems today with the SPI335-14 and experience the difference in performance and quality.

Feature Benefit Bullets

Maximum VCEsat: 0.5 V

Low VCEsat helps in reducing power dissipation and improving efficiency of the linear position sensor.

Output Circuit Type: Transistor

Transistor output circuit provides fast response time and accurate signal output for precise linear position measurements.

Maximum Operating Temperature: 80 °C

High maximum operating temperature ensures reliable performance in a wide range of industrial environments.

Response Time: 5 us

Fast response time of 5 microseconds enables real-time monitoring and control of linear position changes.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature allows for use in cold environments without compromising sensor functionality.

Maximum Output Voltage: 20 V

High maximum output voltage provides a strong signal for accurate linear position measurements.

Maximum Operating Current: 50 mA

Low maximum operating current helps in reducing power consumption and heat generation in the sensor.

Maximum Output Current: 1.1 A

High maximum output current capability allows for driving various loads without the need for external amplification.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mount design facilitates easy installation and secure placement of the linear position sensor in industrial equipment.

Gap Size: 0.001 mm

Very small gap size enables highly precise linear position measurements with minimal mechanical tolerances.

Technical Specifications

Linear Position Sensors SPI335-14 attributes and parameters. Explore more Linear Position Sensors devices from Onsemi

Specs

Gap Size:

.001 mm

Mounting Feature:

No. of Channels:

1

Maximum Operating Current:

50 mA

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Output Circuit Type:

Transistor

Maximum Output Current:

1.1 A

Maximum Output Voltage:

20 V

Response Time:

5 us

Sub-Category:

Position, Linear, Photoelectric Sensors

Maximum VCEsat:

.5 V

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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