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SPI333-34

Onsemi

SPI333-34 by Onsemi

SPI333-34 by Onsemi is a Linear Position Sensor with VCEsat of 0.5V, operating temp range -20 to 80 °C, and max output voltage of 5V. Ideal for applications requiring precise gap sensing in THROUGH HOLE MOUNT setups.

Median Price

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Lifecycle Status

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Vyrian

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Digiode

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Metaverse IC Inc.

Canada . 6,000 parts In-Stock

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SupplyDigital Components

Austria . 4,274 parts In-Stock

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TANS Electronics

Latvia . 2,623 parts In-Stock

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Corphita

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Kepictronics

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Problanco Electronics

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Kulean Microsystems

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UHIMA Technologies

Türkiye . 319 parts In-Stock

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Overview

Unlock precision and reliability with the SPI333-34 Linear Position Sensor from Onsemi. Trusted for their superior quality and cutting-edge technology, Onsemi's sensors are designed to provide accurate measurements in a wide range of applications. Perfect for industries like automotive, aerospace, and robotics, this sensor offers unparalleled value and performance. Say goodbye to guesswork and hello to precise data with the SPI333-34.

Feature Benefit Bullets

Maximum VCEsat: 0.5 V

Low VCEsat ensures minimal voltage drop across the sensor, leading to accurate and efficient signal readings.

Output Circuit Type: Transistor

Utilizing a transistor output circuit ensures reliable and precise signal transmission for improved performance.

Maximum Operating Temperature: 80 °C

With a high maximum operating temperature, this sensor can withstand harsh environmental conditions and maintain accuracy.

Minimum Operating Temperature: -20 °C

The wide temperature range allows this sensor to be used in various applications without compromising functionality.

Maximum Output Voltage: 5 V

The high output voltage provides strong and consistent signals for better control and monitoring.

Maximum Operating Current: 50 mA

With a low operating current, this sensor is energy-efficient and can be used in power-sensitive applications.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature offers secure and stable installation for reliable and accurate position sensing.

Gap Size: 0.004 mm

The small gap size allows for precise positioning detection, making this sensor ideal for applications requiring high resolution.

Technical Specifications

Linear Position Sensors SPI333-34 attributes and parameters. Explore more Linear Position Sensors devices from Onsemi

Specs

Gap Size:

.004 mm

Mounting Feature:

No. of Channels:

1

Maximum Operating Current:

50 mA

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Output Circuit Type:

Transistor

Maximum Output Voltage:

5 V

Sub-Category:

Position, Linear, Photoelectric Sensors

Maximum VCEsat:

.5 V

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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