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SMMBTA14LT3G

Onsemi

SMMBTA14LT3G by Onsemi

SMMBTA14LT3G by Onsemi is a NPN BJT transistor with max power dissipation of 0.3W, hFE of 5000, and fT of 125MHz. Ideal for applications requiring high DC current gain and fast transition frequency in surface mount configurations.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Chip Stock

USA . 22,000 parts In-Stock

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Vyrian

USA . 4,974 parts In-Stock

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Digiode

USA . 2,117 parts In-Stock

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AZTECH Wire

Italy . 466 parts In-Stock

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$16.040

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SupplyDigital Components

Austria . 7,931 parts In-Stock

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TANS Electronics

Latvia . 6,743 parts In-Stock

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Corphita

USA . 2,381 parts In-Stock

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Kulean Microsystems

USA . 1,509 parts In-Stock

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Problanco Electronics

Mexico . 1,123 parts In-Stock

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Corohmni

South Africa . 363 parts In-Stock

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UHIMA Technologies

Türkiye . 151 parts In-Stock

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Overview

Discover the power of innovation with the SMMBTA14LT3G by Onsemi. As a leading manufacturer in the industry, Onsemi has crafted a top-quality Small Signal Bipolar Junction Transistor for NPN applications. This versatile product offers customers unrivaled performance and reliability, making it ideal for a wide range of electronics projects. With a maximum power dissipation of 0.3 W and a minimum DC current gain of 5000, the SMMBTA14LT3G ensures superior functionality and efficiency. Trust Onsemi to deliver excellence with every component, providing you with the tools you need to bring your creations to life.

Feature Benefit Bullets

Polarity or Channel Type: NPN

NPN transistors are commonly used and have versatile applications in electronic circuits.

Configuration: SINGLE

Having a single configuration simplifies circuit design and integration.

Surface Mount: YES

Surface mount capability makes it easier to integrate this transistor into modern PCB designs.

Maximum Power Dissipation (Abs): 0.3 W

The high maximum power dissipation allows for reliable operation under various conditions.

Minimum DC Current Gain (hFE): 5000

Having a high minimum DC current gain ensures stable and predictable amplification in circuits.

Maximum Operating Temperature: 150 °C

The high operating temperature range allows for use in a wide range of environments.

Maximum Collector Current (IC): 0.3 A

The maximum collector current rating of 0.3 A allows for handling moderate current levels.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature helps to prevent overheating during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and reliability during assembly.

Nominal Transition Frequency (fT): 125 MHz

The high nominal transition frequency allows for high-speed switching and signal processing in circuits.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) SMMBTA14LT3G attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Configuration:

Minimum DC Current Gain (hFE):

5000

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Nominal Transition Frequency (fT):

Trade Compliance

SMMBTA14LT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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