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NVTFWS016N06CTAG

Onsemi

NVTFWS016N06CTAG by Onsemi

NVTFWS016N06CTAG by Onsemi is a Power FET with N-CHANNEL polarity, 60V DS Breakdown Voltage, and 160A IDM. Ideal for applications requiring high power dissipation in small outline packages, such as automotive electronics or industrial control systems.

Median Price

$0.747

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,459 parts In-Stock

1+ parts

$2.010

100+ parts

$0.868

1k+ parts

$0.690

10k+ parts

$0.530

1,459

$2.010

$0.868

$0.690

$0.530

Verical

USA . 1,300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.747

10k+ parts

$0.666

1,300

-

-

$0.747

$0.666

Rochester

USA . 1,300 parts In-Stock

1+ parts

-

100+ parts

$0.720

1k+ parts

$0.597

10k+ parts

$0.533

1,300

-

$0.720

$0.597

$0.533

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 16,500 parts In-Stock

1+ parts

-

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16,500

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Vyrian

USA . 2,926 parts In-Stock

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2,926

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Digiode

USA . 1,997 parts In-Stock

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1,997

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-

Distributors (Availability)

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Microchip USA

USA . 4,680 parts In-Stock

1+ parts

$4.382

100+ parts

-

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4,680

$4.382

-

-

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AZTECH Wire

Italy . 471 parts In-Stock

1+ parts

$20.590

100+ parts

-

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471

$20.590

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-

TANS Electronics

Latvia . 8,352 parts In-Stock

1+ parts

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8,352

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Kulean Microsystems

USA . 7,572 parts In-Stock

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7,572

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SupplyDigital Components

Austria . 4,962 parts In-Stock

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4,962

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Problanco Electronics

Mexico . 2,621 parts In-Stock

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2,621

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UHIMA Technologies

Türkiye . 769 parts In-Stock

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769

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Corphita

USA . 703 parts In-Stock

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703

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Corohmni

South Africa . 215 parts In-Stock

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215

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Overview

Enhance your power management systems with the NVTFWS016N06CTAG by Onsemi, a high-quality Power FET that offers exceptional performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this N-channel transistor with a built-in diode is perfect for a wide range of applications. From automotive to industrial settings, this transistor provides efficient power control with its low on-resistance and high current capabilities. Experience the value and benefits of this product today and take your power management to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the internal components of the power FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher electron mobility, making them efficient for high-power applications.

Minimum DS Breakdown Voltage: 60 V

The high breakdown voltage of 60V allows the FET to handle high voltage applications without risk of damage.

Maximum Drain Current (ID): 32 A

The high maximum drain current rating of 32A enables the FET to handle high power loads without overheating.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are normally off and require a positive voltage at the gate terminal to turn on, providing better control and efficiency.

Maximum Power Dissipation (Abs): 36 W

With a maximum power dissipation of 36W, this FET can handle high power applications without risking thermal damage.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175 °C allows the FET to operate in high temperature environments without performance degradation.

Maximum Feedback Capacitance (Crss): 5.7 pF

The low feedback capacitance of 5.7pF helps in minimizing parasitic capacitance and improving high-frequency performance of the FET.

Technical Specifications

Power Field Effect Transistors (FET) NVTFWS016N06CTAG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

22 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

32 A

Maximum Drain Current (ID):

32 A

Maximum Drain-Source On Resistance:

.0163 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

5.7 pF

JESD-30 Code:

S-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

160 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVTFWS016N06CTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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