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NVTFS5826NLTWG

Onsemi

NVTFS5826NLTWG by Onsemi

NVTFS5826NLTWG by Onsemi is a Power FET with 60V DS Breakdown Voltage, 127A IDM, and 0.032 ohm RDS(on). Ideal for applications requiring high power dissipation in a compact form factor. Suitable for use in enhancement mode operation at temperatures up to 175 °C.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Chip Stock

USA . 679,612 parts In-Stock

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Flip Electronics

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Vyrian

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Digiode

USA . 1,605 parts In-Stock

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AZTECH Wire

Italy . 1,120 parts In-Stock

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Perfect Parts

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Kulean Microsystems

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TANS Electronics

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SupplyDigital Components

Austria . 6,625 parts In-Stock

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Problanco Electronics

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Authorized Procurement Solutions

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Corphita

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UHIMA Technologies

Türkiye . 777 parts In-Stock

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Corohmni

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Overview

Experience the power of innovation with the NVTFS5826NLTWG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) that provide reliable performance and efficiency. With a single configuration and built-in diode, this N-channel transistor offers seamless integration for a variety of applications. Whether you're in automotive, industrial, or consumer electronics, this product's high breakdown voltage, low on-resistance, and enhanced mode operation ensure optimal functionality and durability. Trust Onsemi to bring value, benefits, and advantages to your projects with the NVTFS5826NLTWG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the Power FET, making it suitable for various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance characteristics compared to P-channel FETs, providing efficient and reliable operation in power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier design integration and protection against reverse voltage, enhancing the overall functionality of the Power FET.

Surface Mount: YES

Surface mount capability enables easy and convenient installation of the Power FET on circuit boards, saving space and reducing assembly time.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this Power FET can handle higher voltages without breakdown, ensuring reliable performance in high-power applications.

Package Shape: SQUARE

The square package shape provides a compact form factor, ideal for space-constrained applications where efficiency and size are important factors.

Maximum Pulsed Drain Current (IDM): 127 A

The high pulsed drain current rating allows the Power FET to handle short-term overload conditions, making it suitable for demanding power delivery requirements.

Avalanche Energy Rating (EAS): 20 mJ

The high avalanche energy rating indicates the ability of this Power FET to withstand high-energy transients, ensuring reliable operation in harsh environments.

Maximum Drain Current (Abs) (ID): 20 A

The high maximum drain current rating allows the Power FET to handle heavy loads without overheating, ensuring stable and efficient operation.

No. of Terminals: 5

Having five terminals provides flexibility in circuit connections, allowing for versatile integration and compatibility with different circuit configurations.

Maximum Power Dissipation (Abs): 3.2 W

The high power dissipation rating ensures efficient heat dissipation, preventing overheating and maintaining stable performance under heavy load conditions.

Package Style (Meter): SMALL OUTLINE

The small outline package style makes the Power FET suitable for compact designs, enabling space-saving and efficient solutions in various applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability, making this Power FET a dependable choice for power applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this Power FET can operate effectively in elevated temperature environments without performance degradation.

Transistor Element Material: SILICON

Silicon material provides excellent electrical properties and durability, ensuring long-term reliability and stable performance of the Power FET.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish with annealing enhances the solderability and conductivity of the terminals, ensuring reliable connections and efficient operation.

Maximum Drain Current (ID): 7.6 A

The high maximum drain current rating allows for reliable operation and performance under heavy load conditions, making this Power FET suitable for power applications.

Maximum Drain-Source On Resistance: 0.032 ohm

The low drain-source on resistance results in minimal power loss and efficient operation, making this Power FET an ideal choice for high-power applications.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit design and layout, allowing for easy integration and connection in various applications.

Case Connection: DRAIN

The drain case connection simplifies the circuit design and layout, providing a convenient connection point for the drain terminal of the Power FET.

Technical Specifications

Power Field Effect Transistors (FET) NVTFS5826NLTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

20 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

20 A

Maximum Drain Current (ID):

7.6 A

Maximum Drain-Source On Resistance:

.032 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

127 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

NVTFS5826NLTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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