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NVTFS4824NWFTWG

Onsemi

NVTFS4824NWFTWG by Onsemi

NVTFS4824NWFTWG by Onsemi is a single N-channel power FET with 46A max drain current and 21W max power dissipation. Ideal for applications requiring high-power handling in surface-mount configurations, such as automotive systems and industrial controls.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,169 parts In-Stock

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Digiode

USA . 773 parts In-Stock

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AZTECH Wire

Italy . 965 parts In-Stock

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$10.420

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Component Stockers USA

USA . 416 parts In-Stock

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$99.990

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Problanco Electronics

Mexico . 5,496 parts In-Stock

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TANS Electronics

Latvia . 3,028 parts In-Stock

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SupplyDigital Components

Austria . 2,868 parts In-Stock

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Kulean Microsystems

USA . 1,484 parts In-Stock

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Corphita

USA . 1,368 parts In-Stock

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Corohmni

South Africa . 223 parts In-Stock

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UHIMA Technologies

Türkiye . 134 parts In-Stock

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Overview

Upgrade your power management system with the NVTFS4824NWFTWG by Onsemi. This high-quality N-CHANNEL Power Field Effect Transistor offers a maximum drain current of 46 A and a maximum power dissipation of 21 W, ensuring optimal performance for a variety of applications. With its single configuration and surface mount capability, this FET is easy to install and delivers reliable power control. Trust in Onsemi's expertise in semiconductor technology to provide you with a product that exceeds expectations. Unlock the potential of your electronic devices with the NVTFS4824NWFTWG.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs are often preferred for high power applications as they offer lower on-state resistance and higher current handling capabilities compared to P-channel FETs.

Surface Mount: YES

Surface mount packaging allows for easier and more compact integration onto PCBs, making the product suitable for space-constrained applications.

Maximum Drain Current (ID): 46 A

The high maximum drain current rating of 46 A indicates that this FET can handle high power loads, making it suitable for applications requiring high current handling capabilities.

Maximum Power Dissipation: 21 W

With a maximum power dissipation of 21 W, this FET is capable of dissipating heat efficiently, ensuring reliable operation even under high power conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor technology offers good switching performance and high efficiency, making the FET suitable for power electronics applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175 °C allows the FET to operate reliably in high-temperature environments without the risk of overheating.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and ensures reliable electrical connections, making the product suitable for high-reliability applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds indicates that the FET can withstand the reflow soldering process without damage, ensuring robust manufacturing processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C indicates compatibility with standard reflow soldering processes, ensuring easy and reliable assembly onto PCBs.

Technical Specifications

Power Field Effect Transistors (FET) NVTFS4824NWFTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

46 A

Maximum Drain Current (ID):

46 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NVTFS4824NWFTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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