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NVTFS4824NWFTAG

Onsemi

NVTFS4824NWFTAG by Onsemi

NVTFS4824NWFTAG by Onsemi is a single N-channel Power FET with 46A max drain current and 21W max power dissipation. Ideal for applications requiring high power handling in surface mount configurations, such as automotive electronics and industrial control systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,987 parts In-Stock

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Digiode

USA . 1,519 parts In-Stock

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AZTECH Wire

Italy . 304 parts In-Stock

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$10.320

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QUARKTWIN TECHNOLOGY LTD

USA . 12,130 parts In-Stock

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Problanco Electronics

Mexico . 7,216 parts In-Stock

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TANS Electronics

Latvia . 5,170 parts In-Stock

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SupplyDigital Components

Austria . 4,955 parts In-Stock

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Kulean Microsystems

USA . 4,563 parts In-Stock

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Corphita

USA . 859 parts In-Stock

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Corohmni

South Africa . 116 parts In-Stock

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UHIMA Technologies

Türkiye . 115 parts In-Stock

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Overview

Looking for a reliable power field effect transistor for your electronic projects? Look no further than the NVTFS4824NWFTAG by Onsemi! With a maximum drain current of 46A and a power dissipation of 21W, this N-CHANNEL FET is perfect for applications where efficiency and performance are key. Onsemi's reputation for high-quality semiconductor products ensures that you're getting a top-notch component that will deliver outstanding results. Whether you're designing power supplies, motor controls, or voltage regulators, the NVTFS4824NWFTAG offers unmatched value, reliability, and efficiency for all your needs. Upgrade your projects with the best - choose Onsemi.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are widely used for high power applications due to their superior efficiency and performance.

Configuration: SINGLE

SINGLE configuration FETs are easier to design with and implement, making them a reliable choice for various applications.

Surface Mount: YES

Surface mount FETs are more compact, efficient, and easier to solder, making them ideal for applications where space is limited.

Maximum Drain Current (Abs) (ID): 46 A

With a high maximum drain current capacity of 46 A, this FET can handle large current loads, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 21 W

The high maximum power dissipation of 21 W ensures that this FET can handle high power levels without overheating, providing reliability and longevity.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

METAL-OXIDE SEMICONDUCTOR FETs offer low gate drive power, high input impedance, and fast switching speeds, making them ideal for high-frequency applications.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175 °C, this FET can operate in high-temperature environments without performance degradation, ensuring reliability under extreme conditions.

Terminal Finish: MATTE TIN

MATTE TIN terminal finish provides good solderability and corrosion resistance, ensuring reliable connections and durability in various operating conditions.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this FET can withstand the soldering process without damage, ensuring ease of assembly and reliability.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C ensures proper soldering and compatibility with standard reflow soldering processes, making integration into manufacturing processes easier.

Technical Specifications

Power Field Effect Transistors (FET) NVTFS4824NWFTAG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

46 A

Maximum Drain Current (ID):

46 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NVTFS4824NWFTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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