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NVTFS4823NWFTWG

Onsemi

NVTFS4823NWFTWG by Onsemi

NVTFS4823NWFTWG by Onsemi is a single N-channel Power FET with 30A max drain current and 21W max power dissipation. Ideal for applications requiring high-power handling in surface-mount configurations, such as automotive systems or industrial equipment.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

USA . 5,000 parts In-Stock

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Bristol Electronics

USA . 10,000 parts In-Stock

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Flip Electronics

USA . 5,000 parts In-Stock

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Vyrian

USA . 2,060 parts In-Stock

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Digiode

USA . 1,921 parts In-Stock

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AZTECH Wire

Italy . 284 parts In-Stock

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SupplyDigital Components

Austria . 7,391 parts In-Stock

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Kulean Microsystems

USA . 5,622 parts In-Stock

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TANS Electronics

Latvia . 4,013 parts In-Stock

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Problanco Electronics

Mexico . 3,702 parts In-Stock

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Corphita

USA . 2,221 parts In-Stock

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UHIMA Technologies

Türkiye . 691 parts In-Stock

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Corohmni

South Africa . 286 parts In-Stock

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Overview

Unlock the power of innovation with the NVTFS4823NWFTWG by Onsemi. Crafted with precision and expertise, this N-CHANNEL Power FET offers unparalleled performance for a wide range of applications. From automotive to industrial, its reliable single configuration and high current capacity make it a versatile choice for any project. Experience the seamless integration of METAL-OXIDE SEMICONDUCTOR technology and maximize efficiency with a maximum power dissipation of 21W. Trust in Onsemi's reputation for quality and elevate your designs with the NVTFS4823NWFTWG.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs typically have better performance characteristics compared to P-CHANNEL FETs, making this product suitable for high-power applications.

Surface Mount: YES

Surface mount packaging allows for easy and efficient assembly onto circuit boards, saving time and effort during manufacturing.

Maximum Drain Current (Abs) (ID): 30 A

With a high maximum drain current rating, this FET can handle large loads and effectively control high-current circuits.

Maximum Power Dissipation (Abs): 21 W

The high power dissipation rating ensures that the FET can handle power spikes and heat dissipation effectively, increasing reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor technology offers high switching speeds and low on-state resistance, making this FET efficient and ideal for power applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature tolerance allows the FET to operate reliably in harsh environments without overheating.

Terminal Finish: MATTE TIN

Matte Tin terminal finish provides good solderability and ensures a secure electrical connection, improving the overall performance and longevity of the product.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature minimizes thermal stress on the FET during soldering, preventing damage and ensuring proper functionality.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for reliable soldering processes without compromising the integrity of the FET.

Technical Specifications

Power Field Effect Transistors (FET) NVTFS4823NWFTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

30 A

Maximum Drain Current (ID):

30 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NVTFS4823NWFTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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