Loading...

NVTFS007N08HLTAG

Onsemi

NVTFS007N08HLTAG by Onsemi

NVTFS007N08HLTAG by Onsemi is a Power FET with 80V DS Breakdown Voltage, 347A IDM, and 0.007 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 compliance.

Median Price

$1.830

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,221 parts In-Stock

1+ parts

$1.830

100+ parts

$0.783

1k+ parts

$0.620

10k+ parts

$0.465

1,221

$1.830

$0.783

$0.620

$0.465

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,975 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,975

-

-

-

-

Digiode

USA . 2,304 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,304

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 2,892 parts In-Stock

1+ parts

$3.847

100+ parts

-

1k+ parts

-

10k+ parts

-

2,892

$3.847

-

-

-

Component Stockers USA

USA . 4,878 parts In-Stock

1+ parts

$9.190

100+ parts

-

1k+ parts

-

10k+ parts

-

4,878

$9.190

-

-

-

AZTECH Wire

Italy . 196 parts In-Stock

1+ parts

$17.900

100+ parts

-

1k+ parts

-

10k+ parts

-

196

$17.900

-

-

-

iodParts Technologies Inc.

India . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,000

-

-

-

-

TANS Electronics

Latvia . 5,309 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,309

-

-

-

-

Corphita

USA . 2,029 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,029

-

-

-

-

SupplyDigital Components

Austria . 1,996 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,996

-

-

-

-

Problanco Electronics

Mexico . 1,801 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,801

-

-

-

-

Corohmni

South Africa . 479 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

479

-

-

-

-

Kulean Microsystems

USA . 289 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

289

-

-

-

-

UHIMA Technologies

Türkiye . 155 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

155

-

-

-

-

Overview

The NVTFS007N08HLTAG by Onsemi is a superior quality Power Field Effect Transistor (FET) with unmatched performance and reliability. Designed with advanced technology, this N-CHANNEL transistor offers enhanced efficiency and power management capabilities, making it ideal for a wide range of applications. With a maximum operating temperature of 175 °C and a minimum operating temperature of -55°C, this FET ensures consistent performance in any environment. Trust Onsemi's reputation for excellence and choose the NVTFS007N08HLTAG for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the internal components of the power FET, resulting in a long-lasting and reliable product.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL configuration provides efficient performance and low resistance, making this power FET suitable for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the functionality of the power FET, allowing for improved energy efficiency and protection against reverse voltage.

Surface Mount: YES

Being surface mountable, this power FET offers easy and convenient installation in a variety of electronic devices and applications.

Maximum Pulsed Drain Current (IDM): 347 A

With a high maximum pulsed drain current, this power FET can handle heavy loads and provide reliable performance under demanding conditions.

Maximum Power Dissipation (Abs): 79 W

The high maximum power dissipation rating ensures efficient heat dissipation and thermal management, contributing to the overall performance and longevity of the power FET.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this power FET can withstand elevated temperatures and harsh environments, making it suitable for a wide range of applications.

Maximum Drain Current (ID): 71 A

The high maximum drain current rating allows for reliable and consistent power delivery, making this power FET ideal for high-current applications.

Maximum Drain-Source On Resistance: 0.007 ohm

The low drain-source on resistance minimizes power loss and improves efficiency, making this power FET an excellent choice for high-performance systems.

Technical Specifications

Power Field Effect Transistors (FET) NVTFS007N08HLTAG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1433 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (ID):

71 A

Maximum Drain-Source On Resistance:

.007 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

14.1 pF

JESD-30 Code:

S-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

347 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVTFS007N08HLTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20