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NVMFS6H801NWFT3G

Onsemi

NVMFS6H801NWFT3G by Onsemi

NVMFS6H801NWFT3G by Onsemi is a Power FET with 80V DS Breakdown Voltage, 900A IDM, and 960mJ EAS. Ideal for applications requiring high power dissipation in small outline packages, such as automotive electronics. Operating from -55 to 175 °C, it features an N-CHANNEL configuration with built-in diode and metal-oxide semiconductor technology.

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Lifecycle Status

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Vyrian

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AZTECH Wire

Italy . 207 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 21,912 parts In-Stock

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Microchip USA

USA . 11,231 parts In-Stock

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SupplyDigital Components

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Problanco Electronics

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Authorized Procurement Solutions

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TANS Electronics

Latvia . 4,572 parts In-Stock

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Kulean Microsystems

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Corphita

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Corohmni

South Africa . 205 parts In-Stock

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UHIMA Technologies

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Overview

Unleash the power of innovation with the NVMFS6H801NWFT3G by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability in every product. This Power FET is designed for high-performance applications, offering customers unparalleled efficiency and performance. With its N-CHANNEL configuration and built-in diode, this transistor provides seamless operation and optimal functionality. Say goodbye to power limitations and hello to limitless possibilities with the NVMFS6H801NWFT3G. Elevate your projects to new heights with Onsemi's advanced technology and superior craftsmanship.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and lightweight construction, making this FET easy to handle and install.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer better performance and efficiency compared to P-channel types, making them suitable for a wide range of applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for reverse current protection and simplifies circuit design, offering added convenience and protection.

Surface Mount: YES

Surface mount capability enables easy integration onto PCBs, saving space and facilitating automated assembly processes.

Minimum DS Breakdown Voltage: 80 V

High breakdown voltage ensures reliable operation in demanding voltage conditions, adding to the robustness of the product.

Maximum Pulsed Drain Current (IDM): 900 A

High pulsed drain current capability allows for power handling in transient conditions, making this FET suitable for high-performance applications.

Avalanche Energy Rating (EAS): 960 mJ

High avalanche energy rating indicates robustness against avalanche breakdown, ensuring protection against overvoltage events.

Maximum Power Dissipation (Abs): 166 W

High power dissipation capacity allows for reliable operation under high power conditions, contributing to the overall reliability of the product.

Maximum Operating Temperature: 175 °C

Wide operating temperature range enables performance in harsh environments, making this FET suitable for a variety of industrial applications.

Maximum Drain Current (ID): 157 A

High drain current rating allows for efficient power flow, making this FET ideal for high-current applications such as motor control.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS6H801NWFT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

960 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (ID):

157 A

Maximum Drain-Source On Resistance:

.0028 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

22 pF

JESD-30 Code:

R-PDSO-F6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS6H801NWFT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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