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NVMFS6B85NLWFT1G

Onsemi

NVMFS6B85NLWFT1G by Onsemi

NVMFS6B85NLWFT1G by Onsemi is a Power FET with 100V DS Breakdown Voltage, 93A IDM, and 0.072 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 standard compliance. Enhances performance in power management systems with its high current handling capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,806 parts In-Stock

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Digiode

USA . 391 parts In-Stock

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AZTECH Wire

Italy . 1,088 parts In-Stock

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$14.120

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QUARKTWIN TECHNOLOGY LTD

USA . 10,820 parts In-Stock

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Kulean Microsystems

USA . 5,800 parts In-Stock

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TANS Electronics

Latvia . 5,285 parts In-Stock

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SupplyDigital Components

Austria . 3,702 parts In-Stock

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Problanco Electronics

Mexico . 3,515 parts In-Stock

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Corphita

USA . 1,124 parts In-Stock

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UHIMA Technologies

Türkiye . 931 parts In-Stock

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Corohmni

South Africa . 278 parts In-Stock

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Overview

Unleash the power of innovation with the NVMFS6B85NLWFT1G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality in their Power Field Effect Transistors (FET). This N-CHANNEL transistor offers unparalleled performance and reliability with its built-in diode configuration, making it ideal for a wide range of applications. From automotive to industrial electronics, this transistor guarantees maximum efficiency and durability. Elevate your projects with the exceptional value and benefits that the NVMFS6B85NLWFT1G brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, making it ideal for small electronic devices and applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are commonly used in high-power applications and are known for their fast switching capabilities, making them suitable for a wide range of power electronics.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and helps protect the transistor from reverse voltage spikes, improving overall reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to control and have low input capacitance, making them efficient and reliable for various switching applications.

Maximum Power Dissipation (Abs): 42 W

With a high power dissipation rating, this FET can handle heavy loads and high power levels without overheating, ensuring long-term reliability.

Maximum Operating Temperature: 175 °C

The high operating temperature range allows this FET to operate reliably even in elevated temperature environments, making it suitable for industrial applications.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS6B85NLWFT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

116 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

19 A

Maximum Drain Current (ID):

5.6 A

Maximum Drain-Source On Resistance:

.072 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

93 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS6B85NLWFT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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