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NVMFS6B25NLWFT3G

Onsemi

NVMFS6B25NLWFT3G by Onsemi

NVMFS6B25NLWFT3G by Onsemi is a N-CHANNEL FET with 100V DS Breakdown Voltage, 177A IDM, and 0.039 ohm RDS(on). Ideal for power applications in automotive industry due to AEC-Q101 standard compliance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,791 parts In-Stock

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Digiode

USA . 2,087 parts In-Stock

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2,087

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AZTECH Wire

Italy . 1,196 parts In-Stock

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$13.970

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Problanco Electronics

Mexico . 5,323 parts In-Stock

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SupplyDigital Components

Austria . 4,000 parts In-Stock

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Kulean Microsystems

USA . 2,405 parts In-Stock

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Corphita

USA . 1,983 parts In-Stock

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TANS Electronics

Latvia . 1,627 parts In-Stock

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Corohmni

South Africa . 445 parts In-Stock

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UHIMA Technologies

Türkiye . 53 parts In-Stock

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Overview

Discover the NVMFS6B25NLWFT3G by Onsemi, a high-quality Power FET that offers unparalleled performance and reliability. Manufactured by Onsemi, a trusted industry leader, this N-channel transistor is perfect for a wide range of applications. With a single configuration and built-in diode, this transistor provides superior functionality and efficiency. Its small outline package and enhanced mode operation make it ideal for various projects. Experience the value and benefits of the NVMFS6B25NLWFT3G today and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good insulation and resistance to high temperatures, making the product durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and faster switching speeds compared to P-channel FETs, making them suitable for high-efficiency applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode helps to protect the circuit from voltage spikes and reverse polarity, enhancing the overall reliability of the product.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on printed circuit boards, saving space and simplifying assembly processes.

Minimum DS Breakdown Voltage: 100 V

High breakdown voltage ensures the FET can handle higher voltage levels, improving the overall robustness of the product.

Maximum Pulsed Drain Current (IDM): 177 A

High pulsed drain current rating allows the FET to handle sudden spikes in current without getting damaged, making it suitable for high-current applications.

Maximum Power Dissipation (Abs): 62 W

High power dissipation capability enables the FET to handle high power loads efficiently, making it suitable for power-intensive applications.

Maximum Drain-Source On Resistance: 0.039 ohm

Low ON resistance reduces power loss and improves efficiency in the circuit, making the product suitable for high-performance applications.

Maximum Operating Temperature: 175 °C

High maximum operating temperature range allows the FET to withstand elevated temperatures, ensuring reliable performance in harsh environments.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, enhancing the durability of the product.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS6B25NLWFT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

170 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

33 A

Maximum Drain Current (ID):

8 A

Maximum Drain-Source On Resistance:

.039 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

177 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS6B25NLWFT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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