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NVMFS6B05NLWFT3G

Onsemi

NVMFS6B05NLWFT3G by Onsemi

NVMFS6B05NLWFT3G by Onsemi is a Power FET with 100V DS Breakdown Voltage, 330A IDM, and 0.0082 ohm RDS(on). It is an N-CHANNEL MOSFET in a PLASTIC/EPOXY package ideal for automotive applications due to its AEC-Q101 reference standard compliance.

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1k+

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Vyrian

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Digiode

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AZTECH Wire

Italy . 697 parts In-Stock

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Component Stockers USA

USA . 682 parts In-Stock

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$99.990

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Problanco Electronics

Mexico . 6,377 parts In-Stock

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TANS Electronics

Latvia . 6,349 parts In-Stock

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SupplyDigital Components

Austria . 5,857 parts In-Stock

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Kulean Microsystems

USA . 4,199 parts In-Stock

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Corphita

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Microchip USA

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UHIMA Technologies

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Overview

Unleash the power of innovation with the NVMFS6B05NLWFT3G by Onsemi. Crafted to perfection, this Power Field Effect Transistor (FET) boasts unparalleled quality and reliability, making it the ultimate choice for a wide range of applications. With a single configuration and built-in diode, this N-channel transistor delivers exceptional performance while maximizing efficiency. Experience seamless operation and superior functionality with this cutting-edge technology that offers unmatched value and benefits to customers. Elevate your projects with Onsemi's NVMFS6B05NLWFT3G and witness the difference in performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and protection to the internal components of the power FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics and lower on-state resistance, making them a popular choice for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps in protecting the circuit from voltage spikes and reverse current, making this FET suitable for applications where protection is important.

Surface Mount: YES

Being surface mountable makes the FET easy to integrate into electronic circuits and ensures efficient use of space on PCBs.

Minimum DS Breakdown Voltage: 100 V

The high breakdown voltage of 100 V allows the FET to handle higher voltages, making it suitable for a wide range of power applications.

Package Shape: RECTANGULAR

The rectangular package shape provides ease of mounting and alignment on the PCB, simplifying the assembly process.

Maximum Pulsed Drain Current (IDM): 330 A

The high pulsed drain current rating of 330 A allows the FET to handle sudden spikes in current, making it suitable for high-power applications.

Avalanche Energy Rating (EAS): 125 mJ

The high avalanche energy rating of 125 mJ indicates the FET's ability to withstand energy surges, ensuring reliability in rugged operating conditions.

Maximum Drain Current (Abs) (ID): 114 A

The high maximum drain current rating of 114 A indicates the FET's capability to handle high current loads effectively.

No. of Terminals: 5

Having 5 terminals provides flexibility in circuit connections and enables versatile designs in power electronics applications.

Maximum Power Dissipation (Abs): 165 W

The high power dissipation rating of 165 W allows the FET to handle high power levels without overheating, ensuring reliable operation.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making the FET suitable for compact electronic devices and applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance, low on-state resistance, and fast switching speeds, making the FET ideal for power applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175 °C ensures reliable performance even in high-temperature environments.

Transistor Element Material: SILICON

Silicon is a common and reliable material for transistor elements, providing stable and consistent performance in various operating conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55 °C allows the FET to function efficiently in cold environments without performance degradation.

Terminal Finish: MATTE TIN

Matte tin finish on the terminals improves solderability and ensures reliable electrical connections during assembly.

Maximum Drain-Source On Resistance: 0.0082 ohm

The low drain-source on-resistance of 0.0082 ohms minimizes power losses and heat generation, improving overall efficiency.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit connections and enables versatile PCB layouts for customized applications.

Case Connection: DRAIN

The drain connection allows for easy connection to external circuits, simplifying the overall design and integration process.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds ensures proper soldering and minimizes the risk of thermal damage to the FET during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C ensures reliable soldering and thermal stability during the manufacturing process.

Reference Standard: AEC-Q101

Compliance with the AEC-Q101 standard ensures high reliability and quality for automotive electronic applications, making this FET a trusted choice in automotive designs.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS6B05NLWFT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

125 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

114 A

Maximum Drain Current (ID):

114 A

Maximum Drain-Source On Resistance:

.0082 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

330 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS6B05NLWFT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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