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NVMFS5C673NLWFT1G

Onsemi

NVMFS5C673NLWFT1G by Onsemi

NVMFS5C673NLWFT1G by Onsemi is a Power FET with 60V DS Breakdown Voltage, 290A IDM, and 0.013 ohm RDS(on). It is an N-CHANNEL MOSFET in a PLASTIC/EPOXY package ideal for automotive applications due to AEC-Q101 compliance.

Median Price

$0.320

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,100 parts In-Stock

1+ parts

$0.320

100+ parts

$0.310

1k+ parts

$0.310

10k+ parts

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4,100

$0.320

$0.310

$0.310

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Distributors (In-Stock)

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Digiode

USA . 110 parts In-Stock

1+ parts

$0.304

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110

$0.304

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Flip Electronics

USA . 9,000 parts In-Stock

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9,000

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Vyrian

USA . 7,090 parts In-Stock

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7,090

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Distributors (Availability)

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Corphita

USA . 1,883 parts In-Stock

1+ parts

$0.288

100+ parts

-

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1,883

$0.288

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Corohmni

South Africa . 468 parts In-Stock

1+ parts

$0.320

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468

$0.320

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AZTECH Wire

Italy . 1,158 parts In-Stock

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$17.300

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1,158

$17.300

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Kulean Microsystems

USA . 8,178 parts In-Stock

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8,178

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Problanco Electronics

Mexico . 4,694 parts In-Stock

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4,694

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SupplyDigital Components

Austria . 3,758 parts In-Stock

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3,758

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TANS Electronics

Latvia . 1,178 parts In-Stock

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1,178

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UHIMA Technologies

Türkiye . 412 parts In-Stock

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412

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Overview

Discover the exceptional NVMFS5C673NLWFT1G by Onsemi, a top-tier Power FET that sets the standard for quality and performance. With a focus on reliability and efficiency, this N-channel transistor is perfect for a wide range of applications. From automotive to industrial, this single configuration with a built-in diode offers unmatched value and benefits to customers. Trust in Onsemi's expertise and innovation to power your next project with ease and confidence. Elevate your designs with the best in the industry – choose the NVMFS5C673NLWFT1G today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel type transistor offers better efficiency and performance compared to P-Channel types, making it ideal for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the transistor from voltage spikes, enhancing overall reliability.

Surface Mount: YES

Surface mount capability allows for easy and space-saving PCB integration, making it suitable for compact devices.

Minimum DS Breakdown Voltage: 60 V

With a high minimum breakdown voltage, this transistor can handle high voltage applications with ease.

Package Shape: RECTANGULAR

Rectangular package shape facilitates easy mounting and soldering on PCBs, improving assembly efficiency.

Terminal Form: FLAT

Flat terminals ensure reliable electrical connections and ease of soldering, enhancing overall performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for easy control of the transistor's conductivity, enhancing efficiency and performance.

Maximum Pulsed Drain Current (IDM): 290 A

High maximum pulsed drain current rating ensures the transistor can handle sudden surges in current without damage.

Avalanche Energy Rating (EAS): 88 mJ

A high avalanche energy rating indicates the transistor's ability to withstand voltage spikes and transient events, improving overall reliability.

No. of Terminals: 5

Having 5 terminals provides flexibility in circuit connections and enables the transistor to be used in various configurations.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and allows for compact designs in electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and reliability, making this transistor suitable for demanding applications.

Maximum Operating Temperature: 175 °C

High maximum operating temperature allows the transistor to operate in harsh environments without performance degradation.

Transistor Element Material: SILICON

Silicon material ensures high performance and reliability, making this transistor a durable choice for long-term use.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows the transistor to function in cold environments without issues, enhancing its versatility.

Terminal Finish: Matte Tin (Sn) - annealed

Annealed matte tin terminal finish provides corrosion resistance and ensures reliable solder connections, improving overall durability.

Maximum Drain-Source On Resistance: 0.013 ohm

Low maximum drain-source on resistance minimizes power losses and improves efficiency in high-current applications.

Terminal Position: DUAL

Dual terminal position allows for flexible PCB layout and facilitates easy integration into circuit designs.

Case Connection: DRAIN

Drain case connection simplifies circuit design and enhances thermal management, improving overall performance.

Maximum Time At Peak Reflow Temperature (s): 30

30-second maximum time at peak reflow temperature ensures proper soldering and prevents damage to the transistor during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability allows for reliable soldering in manufacturing processes, ensuring product quality.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 standard ensures the transistor meets automotive quality and reliability requirements, making it suitable for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C673NLWFT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

88 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain-Source On Resistance:

.013 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

290 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5C673NLWFT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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