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NVMFS5C670NLWFT3G

Onsemi

NVMFS5C670NLWFT3G by Onsemi

NVMFS5C670NLWFT3G by Onsemi is a N-channel Power FET with 60V DS Breakdown Voltage, 0.0088 ohm RDS(on), and 440A IDM. Ideal for automotive applications due to AEC-Q101 compliance and high EAS of 166mJ. Features single configuration with built-in diode in small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,834 parts In-Stock

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Digiode

USA . 1,295 parts In-Stock

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AZTECH Wire

Italy . 440 parts In-Stock

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$19.600

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440

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QUARKTWIN TECHNOLOGY LTD

USA . 9,971 parts In-Stock

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SupplyDigital Components

Austria . 7,857 parts In-Stock

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TANS Electronics

Latvia . 7,507 parts In-Stock

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Kulean Microsystems

USA . 6,999 parts In-Stock

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Problanco Electronics

Mexico . 1,645 parts In-Stock

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Corphita

USA . 1,290 parts In-Stock

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UHIMA Technologies

Türkiye . 180 parts In-Stock

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Corohmni

South Africa . 179 parts In-Stock

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Overview

Unleash the power of innovation with the NVMFS5C670NLWFT3G by Onsemi! This high-quality Power FET transistor offers unparalleled performance and reliability, making it the perfect choice for a wide range of applications. From automotive to industrial, this N-channel transistor with built-in diode delivers exceptional value, efficiency, and durability. Trust Onsemi's cutting-edge technology and expertise to take your projects to the next level. Experience the difference with the NVMFS5C670NLWFT3G!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers good insulation properties and durability, making the product reliable in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher mobility and faster switching speeds compared to P-channel transistors, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode provides protection against reverse voltage spikes, enhancing the reliability and longevity of the product.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Minimum DS Breakdown Voltage: 60 V

High breakdown voltage ensures the device can handle higher voltages without breakdown, making it suitable for applications requiring robust performance.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of space on a PCB, enabling compact and streamlined designs.

Avalanche Energy Rating (EAS): 166 mJ

High avalanche energy rating indicates the device's ability to withstand voltage spikes or surges, ensuring reliable operation in harsh environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers good performance characteristics such as low leakage current and high efficiency, making the product energy-efficient.

Maximum Drain-Source On Resistance: 0.0088 ohm

Low on-resistance results in reduced power loss and heat generation, improving overall efficiency and performance of the device.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 automotive quality standard ensures the product meets stringent reliability and quality requirements for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C670NLWFT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

166 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain-Source On Resistance:

.0088 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

440 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5C670NLWFT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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