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NVMFS5C646NLT1G

Onsemi

NVMFS5C646NLT1G by Onsemi

NVMFS5C646NLT1G by Onsemi is a N-CHANNEL FET with 93A max drain current and 79W power dissipation. Ideal for high-power applications, it operates at up to 175°C and features surface mount configuration for easy installation in various electronic devices.

Median Price

$2.195

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Component Sense

UK . 21,336 parts In-Stock

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Chip Stock

USA . 5,400 parts In-Stock

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Vyrian

USA . 2,097 parts In-Stock

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Digiode

USA . 1,074 parts In-Stock

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Bristol Electronics

USA . 495 parts In-Stock

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$2.195

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$1.929

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495

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$1.929

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Aztec Data Supply Inc.

USA . 1,165 parts In-Stock

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$1.360

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Microchip USA

USA . 7,300 parts In-Stock

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$3.484

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$3.484

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AZTECH Wire

Italy . 871 parts In-Stock

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$13.495

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871

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Ampacity Inc.

Singapore . 972 parts In-Stock

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$46.050

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972

$46.050

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Semicontronic

India . 893 parts In-Stock

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$54.050

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$52.699

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$52.428

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893

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$52.428

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QUARKTWIN TECHNOLOGY LTD

USA . 11,996 parts In-Stock

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Lixinc

USA . 11,793 parts In-Stock

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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SupplyDigital Components

Austria . 6,734 parts In-Stock

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Problanco Electronics

Mexico . 6,239 parts In-Stock

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Kulean Microsystems

USA . 4,445 parts In-Stock

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Corphita

USA . 1,680 parts In-Stock

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TANS Electronics

Latvia . 1,597 parts In-Stock

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Metaverse IC Inc.

Canada . 1,364 parts In-Stock

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Argo Parts USA

USA . 1,234 parts In-Stock

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Continental Prestige Electronics

USA . 879 parts In-Stock

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UHIMA Technologies

Türkiye . 547 parts In-Stock

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Corohmni

South Africa . 314 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

When it comes to power field effect transistors, the NVMFS5C646NLT1G by Onsemi stands out for its exceptional quality and reliability. Manufactured by Onsemi, a trusted name in the industry, this N-channel FET offers unmatched performance in a variety of applications. With a maximum drain current of 93A and a power dissipation of 79W, this transistor is designed to handle high-power operations with ease. Whether you're looking to improve efficiency in automotive systems or enhance power management in industrial equipment, the NVMFS5C646NLT1G delivers superior value and benefits that customers can rely on.

Feature Benefit Bullets

Polarity or Channel Type

N-CHANNEL - Enables high efficiency switching in power applications.

Configuration

SINGLE - Simplifies circuit design and offers easy integration.

Surface Mount

YES - Facilitates compact and space-saving PCB designs.

Maximum Drain Current (Abs) (ID)

93 A - Capable of handling high current loads efficiently.

Maximum Power Dissipation (Abs)

79 W - Ensures reliable performance under heavy load conditions.

Field Effect Transistor Technology

METAL-OXIDE SEMICONDUCTOR - Offers improved efficiency and stability.

Maximum Operating Temperature

175 °C - Suitable for use in high-temperature environments.

Terminal Finish

Matte Tin (Sn) - annealed - Provides good solderability and durability.

Maximum Time At Peak Reflow Temperature (s)

30 - Ensures proper reflow soldering process for reliable connections.

Peak Reflow Temperature °C

260 - Supports high-temperature soldering for robust connections.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C646NLT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

93 A

Maximum Drain Current (ID):

93 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NVMFS5C646NLT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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