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NVMFS5C628NLT3G

Onsemi

NVMFS5C628NLT3G by Onsemi

NVMFS5C628NLT3G by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage, 900A IDM, and 0.0033 ohm RDS(on). Ideal for power applications in automotive industry due to AEC-Q101 standard compliance and 565mJ EAS rating.

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Vyrian

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Microchip USA

USA . 428 parts In-Stock

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AZTECH Wire

Italy . 1,106 parts In-Stock

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Perfect Parts

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Problanco Electronics

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Kulean Microsystems

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SupplyDigital Components

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TANS Electronics

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Overview

Experience superior power management with the NVMFS5C628NLT3G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that offer unmatched performance and reliability. Ideal for a wide range of applications, this N-CHANNEL transistor with a built-in diode ensures efficient power control in a compact package. Elevate your projects with the enhanced mode operation, high breakdown voltage, and low on-resistance of this innovative component. Trust Onsemi to provide the perfect solution for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making the FET reliable in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have faster switching speeds and lower conduction losses, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the FET from voltage spikes, enhancing overall reliability.

Minimum DS Breakdown Voltage: 60 V

The high breakdown voltage allows the FET to handle high voltage levels, making it suitable for power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer easy controllability and lower power consumption, making them efficient in power management applications.

Maximum Pulsed Drain Current (IDM): 900 A

The high pulsed drain current rating allows the FET to handle sudden current surges without getting damaged, ensuring reliable performance in power circuits.

Avalanche Energy Rating (EAS): 565 mJ

The high avalanche energy rating indicates the FET's ability to withstand energy spikes, increasing its robustness in demanding applications.

Package Style (Meter): SMALL OUTLINE

The small outline package saves space on the PCB, making the FET ideal for compact designs where board real estate is limited.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds and low power losses, making the FET suitable for high-frequency and high-power applications.

Maximum Drain-Source On Resistance: 0.0033 ohm

The low on-resistance ensures minimal power loss and heat generation, improving efficiency and reliability in power conversion circuits.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C628NLT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

565 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain-Source On Resistance:

.0033 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

900 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5C628NLT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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