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NVMFS5C612NLWFT1G

Onsemi

NVMFS5C612NLWFT1G by Onsemi

NVMFS5C612NLWFT1G by Onsemi is a single N-channel Power FET with 235A max drain current and 167W max power dissipation. Utilizes metal-oxide semiconductor technology, operates up to 175 °C, ideal for high-power applications requiring efficient switching capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 7,845 parts In-Stock

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Digiode

USA . 1,203 parts In-Stock

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Microchip USA

USA . 173 parts In-Stock

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$8.262

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AZTECH Wire

Italy . 820 parts In-Stock

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$20.020

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Component Stockers USA

USA . 505 parts In-Stock

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$99.990

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SupplyDigital Components

Austria . 7,797 parts In-Stock

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TANS Electronics

Latvia . 6,250 parts In-Stock

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Corphita

USA . 1,925 parts In-Stock

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Kulean Microsystems

USA . 1,857 parts In-Stock

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UHIMA Technologies

Türkiye . 805 parts In-Stock

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Problanco Electronics

Mexico . 311 parts In-Stock

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Corohmni

South Africa . 240 parts In-Stock

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Overview

Unlock the power of innovation with the NVMFS5C612NLWFT1G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) for a wide range of applications. From automotive to industrial electronics, this N-channel single configuration transistor offers unmatched performance and reliability. With a maximum drain current of 235 A and a power dissipation of 167 W, this METAL-OXIDE SEMICONDUCTOR technology ensures optimal efficiency even in high-temperature environments. Experience the value and benefits of cutting-edge technology with Onsemi's NVMFS5C612NLWFT1G.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are known for their high efficiency and performance in power applications, making this product a good choice for reliable operation.

Configuration: SINGLE

The single configuration simplifies circuit design and enhances system reliability, making this product suitable for various power control applications.

Surface Mount: YES

Surface mount capability allows for easy installation and compact designs, making this product ideal for space-constrained applications.

Maximum Drain Current (ID): 235 A

With a high maximum drain current rating, this FET can handle large current loads effectively, making it a robust choice for power management.

Maximum Power Dissipation: 167 W

The high power dissipation capability of this FET ensures efficient heat dissipation, allowing for continuous operation at high power levels.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

METAL-OXIDE SEMICONDUCTOR technology offers high switching speeds and low on-resistance, providing excellent performance characteristics for power applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures without performance degradation, ensuring reliable operation in demanding environments.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good solderability and corrosion resistance, ensuring a reliable electrical connection for extended product life.

Maximum Time At Peak Reflow Temperature: 30s

The short time at peak reflow temperature minimizes thermal stress on the component during assembly, ensuring the integrity of the FET for long-term use.

Peak Reflow Temperature: 260 C

The high peak reflow temperature tolerance enables compatibility with lead-free soldering processes, making this product suitable for environmentally-friendly manufacturing.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C612NLWFT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

235 A

Maximum Drain Current (ID):

235 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NVMFS5C612NLWFT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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