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NVMFS5C466NT1G

Onsemi

NVMFS5C466NT1G by Onsemi

NVMFS5C466NT1G by Onsemi is a Power FET with N-CHANNEL polarity, 40V DS breakdown voltage, and 226A pulsed drain current. Ideal for applications requiring high power dissipation in small outline packages, such as automotive electronics or industrial control systems.

Median Price

$1.980

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,575 parts In-Stock

1+ parts

$1.980

100+ parts

$0.854

1k+ parts

$0.678

10k+ parts

$0.518

1,575

$1.980

$0.854

$0.678

$0.518

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,846 parts In-Stock

1+ parts

$1.824

100+ parts

-

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1,846

$1.824

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Flip Electronics

USA . 7,500 parts In-Stock

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7,500

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Vyrian

USA . 7,391 parts In-Stock

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7,391

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Distributors (Availability)

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Corphita

USA . 220 parts In-Stock

1+ parts

$1.728

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220

$1.728

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Corohmni

South Africa . 187 parts In-Stock

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$1.920

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187

$1.920

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iodParts Technologies Inc.

India . 200,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 9,028 parts In-Stock

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Problanco Electronics

Mexico . 7,701 parts In-Stock

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Perfect Parts

USA . 6,468 parts In-Stock

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6,468

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Kulean Microsystems

USA . 1,734 parts In-Stock

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1,734

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TANS Electronics

Latvia . 1,613 parts In-Stock

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SupplyDigital Components

Austria . 1,108 parts In-Stock

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UHIMA Technologies

Türkiye . 460 parts In-Stock

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460

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Overview

Experience the unmatched power and performance of the NVMFS5C466NT1G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that guarantee reliability and efficiency. This N-channel transistor with a built-in diode is perfect for a variety of applications, offering customers unparalleled value and benefits. Whether you're looking to enhance your electronic devices or improve system performance, the NVMFS5C466NT1G is the ideal solution. Trust Onsemi to provide cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, ensuring a longer lifespan and reliable performance.

Polarity or Channel Type: N-CHANNEL

Offers efficient current flow and control in electronic circuits, making it suitable for a wide range of applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for protection against reverse current flow, enhancing the reliability of the FET in various operational conditions.

Operating Mode: ENHANCEMENT MODE

Offers precise control over the FET's conductivity, allowing for efficient power management and performance optimization.

Maximum Pulsed Drain Current (IDM): 226 A

High pulsed drain current capability allows for handling sudden surges in power consumption without risking damage to the FET.

Avalanche Energy Rating (EAS): 70 mJ

A high avalanche energy rating ensures reliable operation under stressful conditions, such as voltage spikes or power surges.

Maximum Power Dissipation (Abs): 37 W

Efficient power dissipation capabilities enable the FET to handle high power loads without overheating, ensuring stable performance.

Maximum Operating Temperature: 175 °C

Wide temperature range support allows for use in diverse environments and applications, enhancing the versatility of the FET.

Maximum Drain-Source On Resistance: 0.0081 ohm

Low on-resistance minimizes power loss and heat generation, improving the efficiency and overall performance of the FET.

Reference Standard: AEC-Q101

Compliance with automotive industry standards ensures reliability and quality, making it a suitable choice for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C466NT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

70 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

49 A

Maximum Drain Current (ID):

49 A

Maximum Drain-Source On Resistance:

.0081 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

15 pF

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

226 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5C466NT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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