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NVMFS5C450NT1G

Onsemi

NVMFS5C450NT1G by Onsemi

NVMFS5C450NT1G by Onsemi is a N-CHANNEL FET with 40V DS Breakdown Voltage, 554A IDM, and 0.0033 ohm RDS(on). Ideal for power management applications in automotive industry due to AEC-Q101 compliance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,428 parts In-Stock

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Digiode

USA . 680 parts In-Stock

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680

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AZTECH Wire

Italy . 278 parts In-Stock

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$19.010

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TANS Electronics

Latvia . 7,211 parts In-Stock

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Kulean Microsystems

USA . 6,093 parts In-Stock

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Problanco Electronics

Mexico . 5,567 parts In-Stock

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SupplyDigital Components

Austria . 2,445 parts In-Stock

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Corphita

USA . 2,330 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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UHIMA Technologies

Türkiye . 226 parts In-Stock

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Corohmni

South Africa . 86 parts In-Stock

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Overview

Discover the power of the NVMFS5C450NT1G by Onsemi, a top-quality N-channel Power FET with a built-in diode. Manufactured by Onsemi, this device offers unrivaled performance and reliability in various applications. Its small outline package makes it ideal for surface mount use, while its high operating temperature range ensures durability. With a maximum drain current of 102A and low on-resistance, this FET delivers exceptional power handling capabilities. Experience the superior quality and value that Onsemi products bring to your projects with the NVMFS5C450NT1G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

Offers high electron mobility and fast switching speeds, making it suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse voltage protection, preventing damage to the transistor during operation.

Surface Mount: YES

Enables easy and efficient installation on PCBs, saving space and simplifying the manufacturing process.

Minimum DS Breakdown Voltage: 40 V

Ensures reliable operation and protection against voltage spikes, making it suitable for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 554 A

Capable of handling high current pulses, making it ideal for power management in demanding environments.

Maximum Power Dissipation (Abs): 68 W

Efficiently dissipates heat during operation, allowing the transistor to handle high-power applications without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Provides excellent performance characteristics, such as low on-resistance and high switching speeds, making it ideal for power applications.

Maximum Operating Temperature: 175 °C

Can operate in high-temperature environments without degrading performance, ensuring reliability in demanding conditions.

Maximum Drain-Source On Resistance: 0.0033 ohm

Offers low on-resistance, reducing power losses and improving efficiency in power management applications.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C450NT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

215 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

102 A

Maximum Drain Current (ID):

102 A

Maximum Drain-Source On Resistance:

.0033 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

28 pF

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

554 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5C450NT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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