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NVMFS5C442NT3G

Onsemi

NVMFS5C442NT3G by Onsemi

NVMFS5C442NT3G by Onsemi is a N-CHANNEL FET with 40V DS Breakdown Voltage, 900A IDM, and 0.0023 ohm RDS(on). Ideal for power applications in automotive industry due to AEC-Q101 standard compliance.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Flip Electronics

USA . 667,200 parts In-Stock

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Vyrian

USA . 8,494 parts In-Stock

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Digiode

USA . 1,752 parts In-Stock

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AZTECH Wire

Italy . 42 parts In-Stock

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$19.960

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Problanco Electronics

Mexico . 7,519 parts In-Stock

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SupplyDigital Components

Austria . 7,126 parts In-Stock

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Kulean Microsystems

USA . 5,841 parts In-Stock

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TANS Electronics

Latvia . 2,298 parts In-Stock

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Corphita

USA . 958 parts In-Stock

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UHIMA Technologies

Türkiye . 904 parts In-Stock

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Corohmni

South Africa . 248 parts In-Stock

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Overview

Elevate your power management solutions with the NVMFS5C442NT3G by Onsemi. Crafted with precision and quality, this N-channel Power FET offers unparalleled performance in a variety of applications. With a single configuration featuring a built-in diode, this transistor maximizes efficiency while minimizing space requirements. Whether you're looking to enhance your industrial equipment or upgrade your automotive systems, this product is designed to deliver reliable and consistent results. Experience the value and benefits that only Onsemi can provide with the NVMFS5C442NT3G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good insulation properties and increases the durability of the transistor.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have lower on-resistance and better efficiency compared to P-channel transistors.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for reverse voltage protection and helps prevent damage to the transistor during switching operations.

Surface Mount: YES

Surface mount design allows for easy integration onto PCBs, saving space and simplifying manufacturing processes.

Minimum DS Breakdown Voltage: 40 V

Higher breakdown voltage provides better protection against voltage spikes and overloads.

Maximum Pulsed Drain Current (IDM): 900 A

High pulsed drain current rating allows for efficient handling of large current spikes and surges.

Avalanche Energy Rating (EAS): 220 mJ

High avalanche energy rating ensures the transistor can withstand energy spikes without failing.

Maximum Power Dissipation (Abs): 83 W

High power dissipation rating allows the transistor to handle high power applications without overheating.

Maximum Operating Temperature: 175 °C

Wide operating temperature range makes the transistor suitable for various environmental conditions.

Maximum Feedback Capacitance (Crss): 40 pF

Low feedback capacitance helps in reducing signal distortion and improving overall performance.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C442NT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

220 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

140 A

Maximum Drain Current (ID):

140 A

Maximum Drain-Source On Resistance:

.0023 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

40 pF

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5C442NT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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