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NVMFS5C404NWFT1G

Onsemi

NVMFS5C404NWFT1G by Onsemi

NVMFS5C404NWFT1G by Onsemi is a N-CHANNEL FET with 40V DS Breakdown Voltage, 900A IDM, and 0.0007 ohm RDS(on). Ideal for power applications in automotive industry due to AEC-Q101 standard compliance.

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1k+

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Digiode

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Advanced Electronics

New Zealand . 327 parts In-Stock

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$0.683

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$0.655

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AZTECH Wire

Italy . 304 parts In-Stock

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Microchip USA

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Ampacity Inc.

Singapore . 5,971 parts In-Stock

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Kulean Microsystems

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Overview

Discover the power and reliability of the NVMFS5C404NWFT1G by Onsemi, a top-quality Power Field Effect Transistor that offers superior performance in a compact package. Ideal for a range of applications, this N-CHANNEL FET with a built-in diode is designed for efficiency and durability. With a maximum drain current of 378A and an operating temperature of -55 to 175 °C, this transistor ensures optimal functionality even in challenging conditions. Trust Onsemi's cutting-edge technology and experience seamless operations with the NVMFS5C404NWFT1G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the FET, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

Enhances the performance and efficiency of the FET in electronic circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

Offers convenience and versatility in circuit design with the built-in diode feature.

Surface Mount: YES

Facilitates easy and compact mounting on circuit boards for space-saving designs.

Maximum Pulsed Drain Current (IDM): 900 A

Can handle high pulsed currents, making it suitable for power applications.

Maximum Power Dissipation (Abs): 200 W

Efficiently dissipates heat, ensuring reliable operation under high power conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Provides high switching speeds and low power consumption for efficient performance.

Maximum Operating Temperature: 175 °C

Can operate in high-temperature environments, increasing the versatility of the FET.

Maximum Drain-Source On Resistance: 0.0007 ohm

Offers low resistance for efficient power handling and minimal power loss.

Reference Standard: AEC-Q101

Meets automotive industry standards for quality and reliability in harsh environments.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C404NWFT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

907 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

378 A

Maximum Drain Current (ID):

378 A

Maximum Drain-Source On Resistance:

.0007 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

120 pF

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5C404NWFT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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