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NVMFS5A160PLZT1G

Onsemi

NVMFS5A160PLZT1G by Onsemi

NVMFS5A160PLZT1G by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage and 400A IDM. Ideal for power applications, it operates in Enhancement Mode with 0.0105 ohm Drain-Source On Resistance. Its AEC-Q101 standard makes it suitable for automotive electronics.

Median Price

$1.525

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

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$1.525

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300

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Chip Stock

USA . 9,980 parts In-Stock

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Vyrian

USA . 3,882 parts In-Stock

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Digiode

USA . 1,975 parts In-Stock

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1,975

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Cyclops Electronics Ltd

UK . 1,236 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 286 parts In-Stock

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$1.494

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286

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Continental Prestige Electronics

USA . 4,362 parts In-Stock

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$1.525

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4,362

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$1.494

Netroflash

USA . 2,000 parts In-Stock

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$1.525

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$1.525

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Argo Parts USA

USA . 1,027 parts In-Stock

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$1.525

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$1.930

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$1.756

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$1.583

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$1.756

$1.583

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AZTECH Wire

Italy . 833 parts In-Stock

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$4.985

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833

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Ampacity Inc.

Singapore . 644 parts In-Stock

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$21.050

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644

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RC Electronics

USA . 31,013 parts In-Stock

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Kulean Microsystems

USA . 7,898 parts In-Stock

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Problanco Electronics

Mexico . 7,465 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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SupplyDigital Components

Austria . 5,901 parts In-Stock

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Lixinc

USA . 4,704 parts In-Stock

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TANS Electronics

Latvia . 1,457 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Corphita

USA . 764 parts In-Stock

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764

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UHIMA Technologies

Türkiye . 4 parts In-Stock

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Overview

Elevate your power management solutions with the NVMFS5A160PLZT1G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch Power FETs that guarantee reliability and efficiency. The P-CHANNEL configuration and SINGLE WITH BUILT-IN DIODE design make this transistor ideal for a wide range of applications. From automotive to industrial, this product offers superior performance, high energy ratings, and temperature resilience. Trust Onsemi to provide innovative solutions that meet your power needs with the NVMFS5A160PLZT1G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good thermal conductivity and ensures durability, making the product reliable for long-term use.

Polarity or Channel Type: P-CHANNEL

P-channel FETs have lower conduction losses and can operate at higher voltages, making them suitable for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for protection against reverse current flow, enhancing the product's reliability in various applications.

Surface Mount: YES

Surface mount technology makes the product easy to install and saves space on the circuit board.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this FET can safely handle high voltages in power applications.

Maximum Pulsed Drain Current (IDM): 400 A

The high pulsed drain current rating allows the FET to handle large spikes in current, making it suitable for high-power applications.

Avalanche Energy Rating (EAS): 335 mJ

The high avalanche energy rating indicates the FET's ability to handle high-energy pulses without failing, ensuring reliability in harsh conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds and low on-resistance, making the product efficient and suitable for power applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures, making it suitable for a wide range of environments.

Maximum Drain-Source On Resistance: 0.0105 ohm

Low on-resistance results in minimal power loss and efficient operation, making the product ideal for high-power applications.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5A160PLZT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

335 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain-Source On Resistance:

.0105 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

400 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5A160PLZT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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