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NVMFS5844NLWFT1G

Onsemi

NVMFS5844NLWFT1G by Onsemi

NVMFS5844NLWFT1G by Onsemi is a N-CHANNEL FET with 61A max drain current and 107W power dissipation. Ideal for high-power applications, it operates at up to 175°C and features surface mount configuration for easy installation.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Flip Electronics

USA . 156,000 parts In-Stock

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Vyrian

USA . 8,255 parts In-Stock

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Digiode

USA . 1,200 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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AZTECH Wire

Italy . 897 parts In-Stock

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$6.528

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897

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Ampacity Inc.

Singapore . 1,280 parts In-Stock

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$23.050

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Kulean Microsystems

USA . 5,093 parts In-Stock

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Argo Parts USA

USA . 4,264 parts In-Stock

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SupplyDigital Components

Austria . 3,877 parts In-Stock

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TANS Electronics

Latvia . 1,580 parts In-Stock

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Problanco Electronics

Mexico . 857 parts In-Stock

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UHIMA Technologies

Türkiye . 767 parts In-Stock

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Continental Prestige Electronics

USA . 520 parts In-Stock

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Corphita

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Corohmni

South Africa . 274 parts In-Stock

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Kepictronics

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Experience the power of innovation with the NVMFS5844NLWFT1G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) that offer unparalleled performance and reliability. Whether you're looking to enhance your power management system or optimize your circuit design, this N-CHANNEL FET provides exceptional value, benefits, and advantages to meet your unique needs. Trust Onsemi for cutting-edge technology and superior products that push the boundaries of what's possible. Elevate your projects with the NVMFS5844NLWFT1G and experience the difference today.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are known for their high efficiency and fast switching speeds, making this product suitable for high-performance applications.

Maximum Drain Current (Abs) (ID): 61 A

With a high maximum drain current rating of 61 A, this FET can handle high-power applications with ease, ensuring reliable performance under load.

Maximum Power Dissipation (Abs): 107 W

The high maximum power dissipation rating of 107 W allows this FET to operate efficiently even under high power conditions, making it reliable for demanding applications.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175°C, this FET can withstand high temperatures without compromising performance, ensuring reliability in challenging environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and resistance to corrosion, ensuring a reliable electrical connection and longevity of the product.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5844NLWFT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

61 A

Maximum Drain Current (ID):

61 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NVMFS5844NLWFT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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