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NVMFS5832NLT3G

Onsemi

NVMFS5832NLT3G by Onsemi

NVMFS5832NLT3G by Onsemi is a Power FET with 40V DS Breakdown Voltage, 120A Drain Current, and 0.0072 ohm On Resistance. It is an N-CHANNEL MOSFET in a PLASTIC/EPOXY package ideal for high-power applications requiring fast switching capabilities. Operating in ENHANCEMENT MODE, it offers a max power dissipation of 127W at temperatures up to 175°C.

Median Price

$1.180

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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DigiKey

USA . 105,000 parts In-Stock

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Flip Electronics

USA . 105,000 parts In-Stock

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Chip Stock

USA . 70,000 parts In-Stock

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Vyrian

USA . 10,177 parts In-Stock

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Digiode

USA . 77 parts In-Stock

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Nova Conductors

Japan . 77 parts In-Stock

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AZTECH Wire

Italy . 700 parts In-Stock

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$13.854

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700

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Ampacity Inc.

Singapore . 1,313 parts In-Stock

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$49.050

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Authorized Procurement Solutions

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Kulean Microsystems

USA . 4,478 parts In-Stock

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Problanco Electronics

Mexico . 3,269 parts In-Stock

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SupplyDigital Components

Austria . 3,038 parts In-Stock

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TANS Electronics

Latvia . 2,873 parts In-Stock

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Argo Parts USA

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UHIMA Technologies

Türkiye . 845 parts In-Stock

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Corohmni

South Africa . 380 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 120 parts In-Stock

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Continental Prestige Electronics

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Overview

Enhance your power management solutions with the NVMFS5832NLT3G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that are essential for various applications. This N-channel FET offers unparalleled value with its single configuration and built-in diode, ensuring efficient performance and reliability. Whether you're working on automotive, industrial, or consumer electronics projects, this transistor's high power dissipation and low on-resistance make it the ideal choice. Trust Onsemi to provide cutting-edge technology that meets your power needs effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the transistor, making it durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have faster switching speeds and lower ON resistance, making them efficient for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient and reliable operation in circuits where back EMF protection is required.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Minimum DS Breakdown Voltage: 40 V

This high breakdown voltage ensures the transistor can handle high voltages, making it suitable for various power applications.

Package Shape: RECTANGULAR

The rectangular shape is standard and compact, allowing for easy integration into circuit designs.

Terminal Form: FLAT

Flat terminals provide a solid and secure connection, ensuring stable performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs provide better control over the flow of current, offering improved efficiency in power applications.

Maximum Pulsed Drain Current (IDM): 523 A

The high pulsed drain current capability makes this transistor suitable for applications requiring high power handling capabilities.

Maximum Drain Current (Abs) (ID): 120 A

The high drain current rating allows for reliable performance in high-power circuits.

No. of Terminals: 5

Having 5 terminals provides flexibility in circuit design and connectivity options.

Maximum Power Dissipation (Abs): 127 W

The high power dissipation rating ensures the transistor can handle high power levels without overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it ideal for compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds and low ON resistance, making it efficient for power applications.

Maximum Operating Temperature: 175 °C

With a high operating temperature range, this transistor can withstand harsh operating conditions.

Transistor Element Material: SILICON

Silicon is a common semiconductor material known for its reliability and stability in electronic components.

Terminal Finish: Matte Tin (Sn) - annealed

The annealed matte tin finish provides good corrosion resistance and solderability, ensuring a reliable connection.

Maximum Drain-Source On Resistance: 0.0072 ohm

The low ON resistance helps reduce power losses and improves efficiency in power applications.

Terminal Position: DUAL

Dual terminal positions offer flexibility in circuit layout and design options.

Case Connection: DRAIN

The drain connection allows for efficient heat dissipation, enhancing the overall performance and reliability of the transistor.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5832NLT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

120 A

Maximum Drain Current (ID):

120 A

Maximum Drain-Source On Resistance:

.0072 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

523 A

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5832NLT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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