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NVMFS5830NLT1G

Onsemi

NVMFS5830NLT1G by Onsemi

NVMFS5830NLT1G by Onsemi is a Power FET with 40V DS Breakdown Voltage, 185A Max ID, and 0.0036 ohm RDS(ON). Ideal for automotive applications due to AEC-Q101 standard compliance. Enhances performance in power management systems with its high current handling capabilities.

Median Price

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Lifecycle Status

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4

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1k+

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Chip Stock

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Cyclops Electronics Ltd

UK . 5,386 parts In-Stock

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Vyrian

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Digiode

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AZTECH Wire

Italy . 708 parts In-Stock

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TANS Electronics

Latvia . 7,687 parts In-Stock

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SupplyDigital Components

Austria . 5,621 parts In-Stock

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Kulean Microsystems

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Problanco Electronics

Mexico . 2,400 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 515 parts In-Stock

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South Africa . 107 parts In-Stock

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Overview

Experience the unparalleled quality and reliability of Onsemi with the NVMFS5830NLT1G Power Field Effect Transistor. With a built-in diode, this N-channel transistor offers seamless performance in a wide range of applications. From power management to motor control, this enhancement mode transistor delivers exceptional value by providing high efficiency and durability. Trust Onsemi for cutting-edge technology and superior products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package provides good durability and protection for the transistor, making it suitable for various applications where reliability is important.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower on-resistance and higher efficiency compared to P-channel FETs, making them a good choice for power applications.

Minimum DS Breakdown Voltage: 40 V

The high breakdown voltage allows this FET to withstand high voltage levels, making it suitable for applications where robustness is required.

Maximum Pulsed Drain Current (IDM): 1012 A

The high pulsed drain current rating allows this FET to handle heavy loads or transient spikes effectively, making it ideal for power applications with high current requirements.

Maximum Power Dissipation (Abs): 158 W

The high power dissipation rating indicates that this FET can handle high power levels without overheating, making it reliable for demanding applications.

Maximum Operating Temperature: 175 °C

The high operating temperature range makes this FET suitable for use in environments where temperature fluctuations may occur, ensuring consistent performance.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5830NLT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

361 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

185 A

Maximum Drain Current (ID):

185 A

Maximum Drain-Source On Resistance:

.0036 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

1012 A

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5830NLT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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