Loading...

NVMFS5826NLWFT3G

Onsemi

NVMFS5826NLWFT3G by Onsemi

NVMFS5826NLWFT3G by Onsemi is a single N-channel Power FET with 26A max drain current and 39W max power dissipation. Ideal for applications requiring high power handling, such as motor control systems or power supplies. Operating temperature up to 175 °C makes it suitable for demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,277 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,277

-

-

-

-

Digiode

USA . 1,863 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,863

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 432 parts In-Stock

1+ parts

$21.750

100+ parts

-

1k+ parts

-

10k+ parts

-

432

$21.750

-

-

-

Kulean Microsystems

USA . 6,494 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,494

-

-

-

-

TANS Electronics

Latvia . 5,748 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,748

-

-

-

-

Kepictronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Problanco Electronics

Mexico . 4,062 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,062

-

-

-

-

Corphita

USA . 960 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

960

-

-

-

-

UHIMA Technologies

Türkiye . 678 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

678

-

-

-

-

Corohmni

South Africa . 305 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

305

-

-

-

-

SupplyDigital Components

Austria . 209 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

209

-

-

-

-

Overview

Unleash the power of innovation with the NVMFS5826NLWFT3G by Onsemi. This high-quality N-channel Power FET is designed for maximum performance and efficiency, making it perfect for a wide range of applications. With its single configuration and surface mount capability, this transistor offers unparalleled value and benefits to customers looking to enhance their electronic designs. Trust in Onsemi's reputation for excellence and elevate your projects with the NVMFS5826NLWFT3G.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are known for their high efficiency and low on-state resistance, making this product efficient in power applications.

Configuration: SINGLE

The single configuration simplifies the design and layout of circuits, making it easier to integrate this FET into various applications.

Surface Mount: YES

Surface mount technology allows for compact and space-saving designs, ideal for modern electronic devices with limited space.

Maximum Drain Current (Abs) (ID): 26 A

With a high maximum drain current, this FET can handle large loads and provide reliable power distribution in demanding applications.

Maximum Power Dissipation (Abs): 39 W

The high power dissipation rating ensures the FET can handle heat dissipation effectively, contributing to its overall reliability and longevity.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers improved performance and efficiency compared to traditional FETs, making this product a superior choice for power applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature ensures the FET can withstand elevated temperatures without compromising performance, suitable for applications in harsh environments.

Terminal Finish: TIN

Tin terminal finish provides excellent solderability and corrosion resistance, ensuring a reliable electrical connection for the FET in various operating conditions.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature allows for quick and efficient soldering processes, reducing the risk of thermal damage to the FET during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering of the FET onto PCBs, contributing to the overall reliability and performance of the electronic system.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5826NLWFT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

26 A

Maximum Drain Current (ID):

26 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NVMFS5826NLWFT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20