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NVMFD5875NLT1G

Onsemi

NVMFD5875NLT1G by Onsemi

NVMFD5875NLT1G by Onsemi is an N-channel Power FET with 60V DS breakdown voltage, 80A IDM, and 0.045 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 compliance, it features a small outline package and operates b/w -55 °C to 175°C.

Median Price

$0.622

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 13,500 parts In-Stock

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13,500

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Rochester

USA . 1,500 parts In-Stock

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$0.611

1k+ parts

$0.507

10k+ parts

$0.452

1,500

-

$0.611

$0.507

$0.452

Verical

USA . 1,500 parts In-Stock

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$0.633

10k+ parts

$0.565

1,500

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$0.633

$0.565

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 13,500 parts In-Stock

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13,500

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Vyrian

USA . 4,308 parts In-Stock

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Digiode

USA . 2,083 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 1,128 parts In-Stock

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$16.730

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$16.730

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Perfect Parts

USA . 7,459 parts In-Stock

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7,459

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TANS Electronics

Latvia . 6,996 parts In-Stock

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Kulean Microsystems

USA . 6,877 parts In-Stock

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Problanco Electronics

Mexico . 5,055 parts In-Stock

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Corphita

USA . 1,745 parts In-Stock

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SupplyDigital Components

Austria . 1,637 parts In-Stock

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UHIMA Technologies

Türkiye . 827 parts In-Stock

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Corohmni

South Africa . 284 parts In-Stock

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Overview

Unleash the power of innovation with the NVMFD5875NLT1G by Onsemi. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor (FET) offers unparalleled performance and reliability. Whether you're in automotive, industrial, or consumer electronics, this versatile component is designed to elevate your products to new heights. Benefit from its enhanced efficiency, robust design, and superior capabilities. Trust Onsemi for cutting-edge solutions that deliver value and excellence every time. Elevate your projects with the NVMFD5875NLT1G and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

Allows for efficient power flow in the specified direction, enhancing the overall performance of the product.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

Offers versatility and flexibility in circuit design, accommodating different requirements and applications.

Surface Mount: YES

Enables easy and efficient installation on circuit boards, saving time and effort during manufacturing.

Minimum DS Breakdown Voltage: 60 V

Provides a high level of protection against voltage spikes and surges, ensuring the safety of the connected devices.

Package Shape: RECTANGULAR

Optimizes space utilization on the circuit board, allowing for a compact and efficient design.

Operating Mode: ENHANCEMENT MODE

Ensures fast and efficient switching behavior, improving overall performance and power efficiency.

Maximum Pulsed Drain Current (IDM): 80 A

Supports high-current applications, making it suitable for demanding power management tasks.

Avalanche Energy Rating (EAS): 40 mJ

Offers robustness against voltage spikes and disturbances, enhancing the reliability of the product in harsh environments.

Maximum Drain Current (Abs) (ID): 22 A

Sufficient current-handling capacity for a wide range of applications, ensuring versatility and performance.

No. of Terminals: 8

Provides multiple connection points for versatile circuit configurations, enhancing flexibility in design.

Maximum Power Dissipation (Abs): 32 W

Supports high-power applications, enabling the product to handle heavy loads without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high efficiency and reliability in power management, ensuring consistent performance over time.

Maximum Operating Temperature: 175 °C

Allows the product to operate reliably in high-temperature environments, expanding its potential applications.

Transistor Element Material: SILICON

Provides stability and consistency in performance, ensuring long-term reliability of the product.

Maximum Turn On Time (ton): 11.3 ns

Enables fast switching speeds, improving overall efficiency and reducing power losses.

Minimum Operating Temperature: -55 °C

Allows the product to function in extremely cold conditions, making it suitable for a wide range of environments.

Maximum Turn Off Time (toff): 15.7 ns

Ensures quick turnaround times between power states, enhancing the responsiveness of the product.

Terminal Finish: MATTE TIN

Provides a reliable and long-lasting connection, ensuring stable performance over time.

Maximum Drain Current (ID): 7 A

Suitable for moderate current applications, offering versatility in power management tasks.

Maximum Drain-Source On Resistance: 0.045 ohm

Minimizes power losses and improves efficiency, making the product ideal for high-performance applications.

Terminal Position: DUAL

Enhances connectivity options, allowing for different configurations and connections.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures the product can withstand reflow processes during manufacturing, maintaining its structural integrity.

Peak Reflow Temperature °C: 260

Optimized for high-temperature manufacturing processes, ensuring reliable and consistent soldering.

Reference Standard: AEC-Q101

Complies with industry standards for automotive electronics, ensuring reliable performance in automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NVMFD5875NLT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

40 mJ

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

22 A

Maximum Drain Current (ID):

7 A

Maximum Drain-Source On Resistance:

.045 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

80 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

15.7 ns

Maximum Turn On Time (ton):

11.3 ns

Trade Compliance

NVMFD5875NLT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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